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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVU37P-2FSVH2892E |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XCVU37P-2FSVH2892E Datasheet |
In Stock | 1,417 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .825 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 162960 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 4.51 mm |
No. of Inputs: | 624 |
Surface Mount: | Yes |
No. of Outputs: | 624 |
Position Of Terminal: | Bottom |
No. of Terminals: | 2892 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B2892 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | BGA |
Width: | 55 mm |
Moisture Sensitivity Level (MSL): | 4 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | .876 V |
Nominal Supply Voltage (V): | 0.85 |
No. of Logic Cells: | 2851800 |
No. of CLBs: | 162960 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Package Equivalence Code: | BGA2892,54X54,40 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 55 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 240 °C (464 °F) |