352 Field Programmable Gate Arrays (FPGA) 363

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV300-4BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	1536 CLBS, 322970 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	250 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4036XL-3BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XC40150XV-9BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	5184	CMOS			100000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.2 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352		1.7 mm	35 mm	No			188 MHz				35 mm
XC4085XLA-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz				35 mm
XC4062XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		289	40000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	2304 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XCV200-6BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		260	236666	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	333 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4028XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e1	227 MHz				35 mm
XC4036XL-08BG352I	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	1296	Yes			CMOS		288		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3			No		e0	238 MHz	30 s	288	225 °C (437 °F)
XCV200-6BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	35 mm
XC4028XL-3PG352C	Xilinx	FPGA	Other	Pin/Peg	352	PGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V		85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P352				No		e0	166 MHz
XH4428EX-3BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0					35 mm
XC4085XLA-7BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	294 MHz				35 mm
XC4028EX-3BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1024	Yes		1024	CMOS		256	18000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e0	166 MHz	30 s	256	225 °C (437 °F)	35 mm
XC4028XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e0	263 MHz				35 mm
XC4044XL-3BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1600 CLBS, 27000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XQ4036XL-3BGG352N	Xilinx	FPGA	Military	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XC4028XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4028XL-2PG352C	Xilinx	FPGA	Other	Pin/Peg	352	PGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V		85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P352				No		e0	179 MHz
XCV300E-6BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	260	260 °C (500 °F)	35 mm
XC4036XL-2BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	35 mm
XC40110XV-07BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS		448	75000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 235000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	35 mm
XC4052XLA-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz				35 mm
XC4085XLA-9BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC4044XL-2BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1600 CLBS, 27000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	35 mm
XC4052XLA-07BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e1	294 MHz	30 s		260 °C (500 °F)	35 mm
XC5215-3BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XCV100E-7BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	400 MHz	30 s	196	260 °C (500 °F)	35 mm
XC4028XLA-9BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	1024 CLBS, 18000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e1	227 MHz				35 mm
XH4428EX-3BGG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1					35 mm
XC4062XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		289	40000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4062XLA-8BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	263 MHz				35 mm
XC4085XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC4028EX-1BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS			18000	5		Grid Array, Low Profile			4.75 V	1.27 mm	85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352		1.7 mm	35 mm	No							35 mm
XC4028EX-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			18000	5		Grid Array, Low Profile			4.5 V	1.27 mm			1024 CLBS, 18000 Gates			Bottom	S-PBGA-B352		1.7 mm	35 mm	No			166 MHz				35 mm
XH4436EX-3BGG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1					35 mm
XC5215L-3BG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array, Low Profile			3 V	1.27 mm			484 CLBS, 15000 Gates			Bottom	S-PBGA-B352		1.65 mm	35 mm	No	Typical gates = 15000-23000						35 mm
XC4036XLA-7BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	294 MHz				35 mm
XC4052XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XC4062XLA-07BG352I	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	5472	Yes			CMOS		289		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B352	3			No		e0	294 MHz	30 s	289	225 °C (437 °F)
XCV300E-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	260	260 °C (500 °F)	35 mm
XC4044XL-1BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e0	200 MHz	30 s	320	225 °C (437 °F)	35 mm
XC4085XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4085XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		289	55000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4062XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC4044XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 80000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4028EX-1BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			18000	5		Grid Array, Low Profile			4.5 V	1.27 mm			1024 CLBS, 18000 Gates			Bottom	S-PBGA-B352		1.7 mm	35 mm	No							35 mm
XC4044XL-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	35 mm
XC4036XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 65000 gates	e0	263 MHz	30 s	288	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.