352 Field Programmable Gate Arrays (FPGA) 363

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4028XLA-8BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1024 CLBS, 18000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e1	263 MHz				35 mm
XC4036EX-4BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes		1296	CMOS	288	22000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e0	143 MHz	30 s	288	225 °C (437 °F)	35 mm
XCV150-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS		164674	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	35 mm
XC4044XLA-7BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	294 MHz				35 mm
XC5215-3BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS	244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm		3 ns	484 CLBS, 15000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.65 mm	35 mm	No	Typical gates = 15000-23000	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XCV300E-6BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	357 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV100E-6BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	357 MHz	30 s	196	225 °C (437 °F)	35 mm
XCV300-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	35 mm
XCV150-4BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS		164674	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	35 mm
XC4036XL-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	1296 CLBS, 22000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e0	179 MHz	30 s	288	225 °C (437 °F)	35 mm
XC4036XLA-9BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	227 MHz				35 mm
XC4028XLA-8BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e1	263 MHz				35 mm
XC4044XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC40110XV-9BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS		75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.2 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	188 MHz				35 mm
XC40150XV-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	5184	CMOS		100000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.1 ns	5184 CLBS, 100000 Gates			Bottom	S-PBGA-B352		1.7 mm	35 mm	No			217 MHz				35 mm
XC4044XLA-07BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 80000 gates	e1	294 MHz	30 s		260 °C (500 °F)	35 mm
XC4052XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	4598	Yes	3.6 V	1936	CMOS	289	33000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XCV100E-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	400 MHz	30 s	196	225 °C (437 °F)	35 mm
XC4062XLA-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XC4044XL-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 27000-80000	e1	217 MHz	30 s		260 °C (500 °F)	35 mm
XC4028XL-1BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.3 ns	1024 CLBS, 18000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	35 mm
XC40110XV-8BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS		75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.1 ns	4096 CLBS, 75000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	217 MHz				35 mm
XC4036XLA-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz				35 mm
DL6035BG352GC	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	1024	Yes	3.47 V	1024	CMOS	256		3.3	2.5,3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3		35 mm	No		e0		30 s	256	225 °C (437 °F)	35 mm
XCV100E-6BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	196	260 °C (500 °F)	35 mm
XC4062XLA-09BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4044XLA-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1600 CLBS, 27000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.