40 Field Programmable Gate Arrays (FPGA) 17

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Qualification	JESD-609 Code	Peak Reflow Temperature (C)
M38510/60504BQX	Texas Instruments	FPGA	Military	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	No	5.5 V		CMOS	4000	5	In-Line			4.5 V		125 °C (257 °F)	4000 Gates	-55 °C (-67 °F)		Dual	R-CDIP-T40	No
EPB1400DC	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40	No	e0	220 °C (428 °F)
EPB1400DI	Altera	FPGA	Industrial	Through-Hole	40	DIP	Rectangular	Ceramic	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Dual	R-XDIP-T40	No	e0	220 °C (428 °F)
EP2SGX90FF40C5NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	4828	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EPB1400DC-2	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40	No	e0	220 °C (428 °F)
EP2SGX130GF40C5NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EP2SGX130GF40C3ES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B40	No	e0
EP2SGX130GF40C3NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EP2SGX130GF40C4ES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B40	No	e0
EP2SGX130GF40C5ES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B40	No	e0
EPB1400DM	Altera	FPGA	Military	Through-Hole	40	DIP	Rectangular	Ceramic	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T40	No	e0	220 °C (428 °F)
EPB1400PC-2	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T40	No	e0	220 °C (428 °F)
EPB1400PC	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Plastic	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T40	No	e0	220 °C (428 °F)
EP2SGX90FF40C4NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	4828	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EP2SGX130GF40C4NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	7047	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EP2SGX90FF40C3NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy	Yes	1.25 V	4828	CMOS		1.2	Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40	No	e1
EPB1400PI	Altera	FPGA	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T40	No	e0	220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.