432 Field Programmable Gate Arrays (FPGA) 419

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQV600-4BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0		30 s	316	225 °C (437 °F)	40 mm
XCV600-4BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	3456 CLBS, 661111 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	250 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4052XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	179 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4052XL-2BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XQV600-4BGG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS	MIL-PRF-38535		661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1		30 s		260 °C (500 °F)	40 mm
XC4036XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e0	263 MHz	30 s	288	225 °C (437 °F)	40 mm
XCV600-5BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4052XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC4044XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e0	227 MHz	30 s	320	225 °C (437 °F)	40 mm
XC4062XLA-09BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XC4085XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC40110XV-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	250 MHz				40 mm
XCV300E-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm
XC40200XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	7056	CMOS			130000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm		1.2 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	188 MHz				40 mm
5962-9851101NUC	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Maximum usable gates 130000	e4	166 MHz				40 mm
XC4036XLA-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	263 MHz				40 mm
XC4036EX-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes		1296	CMOS		288	22000	5	5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e0	166 MHz	30 s	288	225 °C (437 °F)	40 mm
XC4052XL-3BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XC40110XV-09BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS		448	75000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.3 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 235000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	40 mm
XC4036XL-1BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.3 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	40 mm
XCV800-4BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		316	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	250 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4052XLA-09BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XC4062XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e0	179 MHz	30 s	384	225 °C (437 °F)	40 mm
XCV800-4BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XC4052XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4036XLA-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1.1 ns	1296 CLBS, 22000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	227 MHz				40 mm
XC4044XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	40 mm
XH4044EX-3BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm
XC4062XL-1BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	2304 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e0	200 MHz	30 s	384	225 °C (437 °F)	40 mm
XH4036EX-3BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm
XH4436EX-3BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm
XC40110XV-9BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm		1.2 ns	4096 CLBS, 75000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	188 MHz				40 mm
XC4085XL-1BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e0	200 MHz	30 s	352	225 °C (437 °F)	40 mm
XC40125XV-2BG432C	Xilinx	FPGA		Ball	432	BGA	Square	Plastic	10982	Yes			CMOS		448			2.5,3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3			No		e0	166 MHz	30 s	448	225 °C (437 °F)
XC4062XLTBGG432	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm			2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm
XC4062XL-09BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000-130000	e1	217 MHz	30 s		260 °C (500 °F)	40 mm
XC40150XV-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 300000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	40 mm
XC40250XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	8464	CMOS			180000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm		1.2 ns	8464 CLBS, 180000 Gates			Bottom	S-PBGA-B432		1.7 mm	40 mm	No			188 MHz				40 mm
XC40110XV-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS		448	75000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.3 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 235000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	40 mm
XC40250XV-08BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.1 ns	8464 CLBS, 180000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	40 mm
XC4044EX-4BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1600	CMOS			27000	5		Grid Array, Low Profile			4.5 V	1.27 mm	100 °C (212 °F)		1600 CLBS, 27000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 27000-80000	e0	111 MHz				40 mm
XCV600E-8BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	416 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4062XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC4085XLA-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	227 MHz				40 mm
XH4052XLBGG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm
DY6020BG432GC	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	576	Yes	3.47 V	576	CMOS		192		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	192	225 °C (437 °F)
XC4036XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e0	179 MHz	30 s	288	225 °C (437 °F)	40 mm
XC4044XLA-07BG432I	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	1600	Yes			CMOS		320		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3			No		e0	294 MHz	30 s	320	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.