432 Field Programmable Gate Arrays (FPGA) 419

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4052XLA-9BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	227 MHz				40 mm
XCV600E-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	357 MHz	30 s	316	260 °C (500 °F)	40 mm
XC4085XL-2BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
5962R9957301NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes							40 mm
XC4044EX-4BGG432C	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1600	CMOS			27000	5		Grid Array, Low Profile			4.75 V	1.27 mm	85 °C (185 °F)		1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 27000-80000	e1	111 MHz				40 mm
XC4052XL-3BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4036XL-2BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XC40110XV-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	217 MHz				40 mm
5962-9957501NUC	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class N		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e4	200 MHz				40 mm
XQ4062XL-3BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC40250XV-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 500000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	40 mm
XCV600E-7BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	400 MHz	30 s	316	260 °C (500 °F)	40 mm
XH4036EX-3BG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm
XCV300E-7BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	400 MHz	30 s	316	260 °C (500 °F)	40 mm
XC4062XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	384	225 °C (437 °F)	40 mm
XC40250XV-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	8464	CMOS			180000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No			217 MHz				40 mm
XCV600E-7BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	400 MHz	30 s	316	260 °C (500 °F)	40 mm
XC4062XLA-09BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XC4062XLA-08BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e1	263 MHz	30 s		260 °C (500 °F)	40 mm
XC4036XL-3BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XC40110XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm		1.2 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	188 MHz				40 mm
XC4036XL-3BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	1296 CLBS, 22000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e0	166 MHz	30 s	288	225 °C (437 °F)	40 mm
XC4085XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4062XL-2BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	2304 CLBS, 40000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XCV300-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4036XL-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 22000-65000	e0	238 MHz	30 s	288	225 °C (437 °F)	40 mm
DY6009BG432EC	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	256	Yes	3.47 V	256	CMOS		128		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	128	225 °C (437 °F)
XC40200XV-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	7056	CMOS			130000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.2 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	188 MHz				40 mm
XH4036XLBG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm
XCV400E-7BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		316	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	2400 CLBS, 129600 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	400 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV400-5BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.7 ns	2400 CLBS, 468252 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XCV300E-7BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	400 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4052XLA-9BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	227 MHz				40 mm
XC4036XLA-7BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	294 MHz				40 mm
XC4052XL-1BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	40 mm
XC4036XLA-08BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	1296 CLBS, 22000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e0	263 MHz	30 s	288	225 °C (437 °F)	40 mm
XC40150XV-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.3 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 300000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	40 mm
DY6020BG432FI	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	192	225 °C (437 °F)
XC4044XL-09BG432I	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	1600	Yes			CMOS		320		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0	217 MHz	30 s	320	225 °C (437 °F)
5962-9957201NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535	316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e0			316		40 mm
XH4436EX-3BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm
XC4052XL-3BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC40110XV-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm		1.1 ns	4096 CLBS, 75000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	217 MHz				40 mm
XC4044XLA-9BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	227 MHz				40 mm
DY6009BG432FI	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	256	Yes	3.6 V	256	CMOS		128		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	128	225 °C (437 °F)
5962-9851101NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e0	166 MHz		352		40 mm
XCV800-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	40 mm
DY6035BG432EC	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	1024	Yes	3.47 V	1024	CMOS		256		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	256	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.