Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
295 |
CMOS |
1200 |
5 |
Chip Carrier |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4.5 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQCC-J44 |
3 |
4.445 mm |
16.51 mm |
No |
MAX 34 I/OS |
e3 |
16.51 mm |
|||||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
230 MHz |
16.5862 mm |
||||||||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4.1 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
190 MHz |
16.5862 mm |
||||||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
16.5862 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
|||||||||
|
Microchip Technology |
FPGA |
Military |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
|||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
3.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
48 MHz |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.5 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
17.82 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
100 MHz |
57 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.25 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
16.632 ns |
295 CLBS, 1200 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
100 MHz |
57 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
14.796 ns |
547 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 273 flip-flops |
69 |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.25 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
13.824 ns |
295 CLBS, 1200 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
57 |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.25 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
16.632 ns |
295 CLBS, 1200 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
100 MHz |
57 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
70 °C (158 °F) |
547 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.5 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
14.796 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
57 |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.5 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
14.796 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
57 |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
5.25 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
16.632 ns |
547 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 273 flip-flops |
100 MHz |
69 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
5.25 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
13.824 ns |
547 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 273 flip-flops |
69 |
16.5862 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
17.82 ns |
547 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 273 flip-flops |
100 MHz |
69 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.5 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
17.82 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
100 MHz |
57 |
16.5862 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.25 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
295 CLBS, 1200 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
57 |
16.5862 mm |
||||||||||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Max usable 2000 Logic gates |
e0 |
113 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
1024 |
CMOS |
3000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1024 CLBS, 3000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
512 flip-flops; 3.3 V operation; OTP based |
16.5862 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
1.75 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Max usable 2000 Logic gates |
e0 |
323 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
192 |
CMOS |
600 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
192 CLBS, 600 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
96 flip-flops; 3.3 V operation; OTP based |
16.5862 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
1500 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.5 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
360 flip-flops; typical gates = 1500-2000 |
125 MHz |
16.5862 mm |
||||||||||||||||
Xilinx |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
3000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
100 CLBS, 3000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C |
50 MHz |
16.5862 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Max usable 2000 Logic gates |
e0 |
113 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
10 ns |
100 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
70 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
9 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA |
e0 |
70 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
3000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
100 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
2.35 mm |
16.5862 mm |
No |
MAX 34 I/OS; 360 flip-flops |
e0 |
50 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
||||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
e0 |
230 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
384 |
CMOS |
1000 |
5 |
Flatpack, Thin Profile |
4.75 V |
.8 mm |
70 °C (158 °F) |
384 CLBS, 1000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
192 flip-flops; 3.3 V operation; OTP based |
10 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.5 ns |
100 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
130 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
384 |
CMOS |
1000 |
5 |
Flatpack, Thin Profile |
4.75 V |
.8 mm |
70 °C (158 °F) |
5.4 ns |
384 CLBS, 1000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
192 flip-flops; 3.3 V operation; OTP based |
144 MHz |
10 mm |
||||||||||||||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 ns |
100 CLBS, 1000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
100 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
100 |
CMOS |
3000 |
5 |
Chip Carrier |
4.5 V |
1.27 mm |
85 °C (185 °F) |
100 CLBS, 3000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
2.35 mm |
16.5862 mm |
No |
MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C |
50 MHz |
16.5862 mm |
|||||||||||||||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
10 ns |
100 CLBS, 1000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
70 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
1024 |
CMOS |
3000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
5.4 ns |
1024 CLBS, 3000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
512 flip-flops; 3.3 V operation; OTP based |
144 MHz |
16.5862 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Max usable 2000 Logic gates |
e0 |
270 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
34 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.318 mm |
16.5862 mm |
No |
360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA |
e0 |
100 MHz |
30 s |
34 |
225 °C (437 °F) |
16.5862 mm |
|||||
Xilinx |
FPGA |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Chip Carrier |
1.27 mm |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
16.5862 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.