44 Field Programmable Gate Arrays (FPGA) 106

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3130A-2PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.2 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2064-70PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130-3PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	34		5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3			No		e0		30 s	34	225 °C (437 °F)
XC8101-2PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC8100-1PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	192	Yes	5.25 V	192	CMOS	32	600	5	3.3/5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	192 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	96 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	32	225 °C (437 °F)	16.5862 mm
XC3130A-5PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		4.1 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Typical gates = 1500-2000	e0	188 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-4PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2064-100PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC8100-2VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	96 flip-flops; 3.3 V operation; OTP based						10 mm
XC8103-3VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	512 flip-flops; 3.3 V operation; OTP based						10 mm
XC3030-100PC44ISPC0107	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		7 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				16.5862 mm
XC3030-50PC44CSPC0107	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		2.35 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				16.5862 mm
XC8103-1VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	512 flip-flops; 3.3 V operation; OTP based		144 MHz				10 mm
XC8101-1PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based		144 MHz				16.5862 mm
XC3030-50PC44ISPC0104	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				16.5862 mm
XC3330A-3PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No							16.5862 mm
XC3030-70PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-3PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	270 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3030-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3030-70PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				16.5862 mm
XC3130A-5PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Typical gates = 1500-2000	e0	188 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC8101-3VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	192 flip-flops; 3.3 V operation; OTP based						10 mm
XC3030-70PC44CSPC0107	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				16.5862 mm
XC3030-50PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	3000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	2.35 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops	e0	50 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2064-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2018-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-4PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.3 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2064-70PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-2PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC8103-2VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	512 flip-flops; 3.3 V operation; OTP based						10 mm
XC3130-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC8103-2PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	512 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC2064-130PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	130 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3030-70PC44ISPC0104	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				16.5862 mm
XC8100-3VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	96 flip-flops; 3.3 V operation; OTP based						10 mm
XC3330A-3PC44C	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No							16.5862 mm
XC3330A-6PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No							16.5862 mm
XC8101-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC3030A-6PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	135 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC8100-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	96 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC3030-70PC44ISPC0107	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				16.5862 mm
XC3030-100PC44CSPC0107	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				16.5862 mm
XC3030-100PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		100 MHz				16.5862 mm
XC8100-1VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)	5.4 ns	192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	96 flip-flops; 3.3 V operation; OTP based		144 MHz				10 mm
XC3130-5PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	190 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-09PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	370 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3330A-6PC44C	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No							16.5862 mm
XC3030-125PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz				16.5862 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.