484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
MPF100TS-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF200TS-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	4	2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF300TL-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF300TLS-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300TS-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284	260 °C (500 °F)	19 mm
XC6SLX150-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	338	250 °C (482 °F)	23 mm
XC6SLX25T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		250		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	250	250 °C (482 °F)	23 mm
XC6SLX45T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX75T-3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX75T-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		268		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	268	225 °C (437 °F)	23 mm
XC6SLX75T-N3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		268		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	268	250 °C (482 °F)	23 mm
XC7A100T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925			285		.95			Grid Array			.92 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	285	250 °C (482 °F)	23 mm
XC7A200T-1SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			285		1			Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7K70T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7S75-1FGGA484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG		400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
5CEBA7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					240		19 mm
5CEBA9F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
5CEFA2F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS		304		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm	No					304		23 mm
5CGTFD9C5F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS		230		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			230		23 mm
A3P600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5			Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			280		23 mm
APA600-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	180 MHz		370		23 mm
AX250-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	2816 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	649 MHz		248		27 mm
EP4CGX110CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839			270		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.4 mm	23 mm	No		e1	472.5 MHz		270		23 mm
EP4CGX75CF23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	73920	Yes	1.24 V	4620			290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		4620 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
LCMXO2-4000HC-6FG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278		2.5	Tray	2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	278	250 °C (482 °F)	23 mm
M1A3P1000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz				23 mm
M2GL010T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL010T-1FG484MX399	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s		240 °C (464 °F)	23 mm
M2GL025S-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3		23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2S010-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	233	250 °C (482 °F)	23 mm
M7A3PE3000-FG484I	Microsemi	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V		CMOS		280	3000000	1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			280		23 mm
MPF100TL-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF100TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF100TS-FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300TL-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
RT3PE3000L-CG484B	Microchip Technology	FPGA	Military		484	CGA	Square	Ceramic, Metal-Sealed Cofired	75264	No	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	CGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X484		6.19 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-CG484PROTO	Microchip Technology	FPGA			484	CGA	Square	Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS			3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-X484		6.19 mm	23 mm								23 mm
XA7A100T-1FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	AEC-Q100	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC3S1400A-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC6SLX150-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	338	225 °C (437 °F)	23 mm
XC6SLX150-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		338		19 mm
XC6SLX150T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XC6SLX25T-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		250		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	250	225 °C (437 °F)	23 mm
XC6SLX75-L1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		280		1		1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	280	250 °C (482 °F)	23 mm
LCMXO3LF-9400C-6BG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			384		2.5			Grid Array			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply				384		19 mm
M2S060-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
EP4CGX150CF23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360			270		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		270		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.