484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX75T-3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		292		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	292	260 °C (500 °F)	19 mm
XC6SLX75T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	292	260 °C (500 °F)	19 mm
10AX022C4U19E3SG	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	TSMC		240		0.9		0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		8033 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					240		19 mm
10CL016ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			340		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				340		19 mm
10CL040YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475					1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
10CL040YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475					1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm			e1		30 s		260 °C (500 °F)	19 mm
10CL040ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475			325		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				325		23 mm
10M08DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
10M25DAF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
10M25DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M50DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125			500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
5CEFA7F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CEFA7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC3B6F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			224		23 mm
5CGXFC3B7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31500	Yes	1.13 V		CMOS		208		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	208	260 °C (500 °F)	23 mm
A3P1000-FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		300	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0			300		23 mm
A3P600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
A3PE3000L-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
AX250-2FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.74 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	870 MHz		248		27 mm
AX500-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.99 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	500000 system gates avaiable	e0	649 MHz		336		27 mm
EP2C20F484C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS		315		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	299	260 °C (500 °F)	23 mm
EP2C50F484C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS		294		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3158 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	278	260 °C (500 °F)	23 mm
EP2S90H484C5	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	36384	CMOS		308		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		36384 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	3.5 mm	27 mm	No		e0			300		27 mm
EP4CE55F23C7	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491			327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP4CGX150CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360			270		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		270		23 mm
LCMXO2-4000HC-4FG484I	Lattice Semiconductor	FPGA		Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278		2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO3LF-9400C-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175					2.5			Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LFE3-35EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		295	250 °C (482 °F)	23 mm
LFXP2-40E-6FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS		363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
M1A3PE3000L-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
M2GL010T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL025T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025TS-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL025TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0					23 mm
M2GL060T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060TS-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2S005-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				209		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	209	250 °C (482 °F)	23 mm
M2S005S-1FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				209		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	209	240 °C (464 °F)	23 mm
M2S025-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S025T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
M2S025TS-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S050-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S050T-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090T-1FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
MPF100TL-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.