484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX100-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
5CEFA5F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
XC7A75T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A50T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1412 MHz	30 s	250	250 °C (482 °F)	23 mm
XC6SLX45-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7A200T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm		1.27 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
EP4CGX30CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
10CL040YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array			1.15 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
XC7A200T-2SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7S75-1FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC7S50-2FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		250		23 mm
EP3C55F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP3C16F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		346		23 mm
M1A3P1000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
XC6SLX75-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	310		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
10M50DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
XC7A50T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	250	250 °C (482 °F)	23 mm
XC7S75-2FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		400		23 mm
M7A3P1000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	300	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No		e1	350 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S50-L1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array	BGA484,22X22,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
10CL120YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	119088	Yes	1.25 V	7443		277		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						277		23 mm
EP4CE75F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		295		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		295		23 mm
XC7A50T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
10AX016C3U19E2LG	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240		0.9		0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No	Also Operates at 0.95 V nominal supply				240		19 mm
M2GL025-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC7A200T-1FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7S50-1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
10CL080YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.25 V	5079		289		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						289		23 mm
A3P1000-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
10CL080YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes		5079				1.2			Grid Array, Fine Pitch				.8 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.2 mm	19 mm								19 mm
M2GL090T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
MPF100T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC6SLX25-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	266	250 °C (482 °F)	23 mm
10M25DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
5CGXFC7C6F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	240	260 °C (500 °F)	23 mm
MPF100T-1FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF100T-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
M2GL025T-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
EP4CE15F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			963 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
M2GL090-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC6SLX150T-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	296	250 °C (482 °F)	23 mm
M2S090TS-1FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
10CL040YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
EP4CGX30CF23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm			1840 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	290	260 °C (500 °F)	23 mm
M2GL010T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V		CMOS	233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	233	250 °C (482 °F)	23 mm
EP2C20F484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	315		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			1172 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	299	260 °C (500 °F)	23 mm
10CL040ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				325		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.