484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX130T-1FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XA6SLX75-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			280		23 mm
XC6SLX150T-N3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	296	225 °C (437 °F)	23 mm
XC6SLX25-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		266		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	266	250 °C (482 °F)	23 mm
XC6SLX100-1LFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz				23 mm
XC6SLX150T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX45-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			320		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			320		19 mm
XA3S200A-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XA6SLX25-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	266			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	266	250 °C (482 °F)
XC3S700A-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XA6SLX75T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		AEC-Q100; TS 16949	268		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	268	250 °C (482 °F)	23 mm
XC6SLX75-N3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	74637	Yes			CMOS		328			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	328	225 °C (437 °F)
XC7Z020-L2CLG484I	Xilinx	FPGA SOC		Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			330	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm			e1		30 s	330	260 °C (500 °F)	19 mm
XC7V855T-1FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC7V855T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC6SLX100-L1CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS		338		1	1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1			338		19 mm
XC6VCX130T-1FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6SLX75T-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		268			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	268	250 °C (482 °F)	23 mm
XQ6SLX75-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		328			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		328	260 °C (500 °F)
XC7K160T-L2FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675	CMOS		285		.9	0.9,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	Also Operates at 1 V supply	e1		30 s	285	250 °C (482 °F)	23 mm
XC6SLX45T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC6SLX150T-3NFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XC3S700AN-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC6SLX75T-4CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	292	260 °C (500 °F)	19 mm
XC6SLX45-L1FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		316		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	316	225 °C (437 °F)	23 mm
XA6SLX45T-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	296	225 °C (437 °F)
XC7K70T-1FBV484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	5125					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm			e1					23 mm
XQ6SLX75T-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		292
XC6VCX130T-2FF484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XA6SLX75-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			328		19 mm
XQ6SLX150T-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1			296	250 °C (482 °F)	23 mm
XC6SLX75T-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	292	225 °C (437 °F)
XC6SLX150-L1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		338		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	338	225 °C (437 °F)	23 mm
XC6SLX45-N3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		316		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	316	225 °C (437 °F)	23 mm
XQ6SLX150-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		338			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	338	225 °C (437 °F)
XC3S1400A-5FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	770 MHz	30 s	288	225 °C (437 °F)	23 mm
XC6SLX45T-3NCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XA6SLX75T-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	268			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	268	225 °C (437 °F)
XA6SLX75T-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	292	225 °C (437 °F)
XC6SLX75T-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XQ6SLX75T-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			292		19 mm
XQ7A50T-1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		23 mm	No		e0	1098 MHz	30 s	250	225 °C (437 °F)	23 mm
XC6SLX100-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911			338		1		Grid Array	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC6SLX150T-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC6VLX130T-1FF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6SLX100-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	338	225 °C (437 °F)
XC6SLX75T-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		268		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	268	225 °C (437 °F)	23 mm
XC6SLX45-1LCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz	30 s		260 °C (500 °F)	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.