484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX100-L1CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	101261	Yes			CMOS		338			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	500 MHz	30 s	338	225 °C (437 °F)
XQ6SLX75-1LCS484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	125 °C (257 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm		e0			328		19 mm
XA6SLX100-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911			326		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0			326		23 mm
XA6SLX45-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			316		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0			316		23 mm
XC6SLX75-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	806 MHz				23 mm
XA6SLX45-3FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	316			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	862 MHz	30 s	316	225 °C (437 °F)
XC6SLX150-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V		CMOS		338		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No	e0	862 MHz	30 s	338	225 °C (437 °F)
XC6SLX100T-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No	e0	667 MHz	30 s	296	225 °C (437 °F)
XQ6SLX75-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e1			280	250 °C (482 °F)	23 mm
XA6SLX45-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	320			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	667 MHz	30 s	320	225 °C (437 °F)
XC6SLX150T-4CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1		30 s	296	260 °C (500 °F)	19 mm
XC6SLX25-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		266		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	862 MHz	30 s	266	225 °C (437 °F)	23 mm
XC6VLX75T-2FFG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes			CMOS		240			1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1	1286 MHz	30 s	240	250 °C (482 °F)
XC6SLX25T-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		250		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	250	250 °C (482 °F)	23 mm
XC6SLX150T-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1		30 s	296	250 °C (482 °F)	23 mm
XQ6SLX150T-3CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No	e1	862 MHz		296
XC6SLX75-L1FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		280		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1		30 s	280	250 °C (482 °F)	23 mm
XC7A200T-L1SBV484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	.98 V	16825					.95		Grid Array, Fine Pitch			.92 V	.8 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	19 mm		e1					19 mm
XC7V855T-2FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XC7V585T-3FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array							91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XA6SLX45-3FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			316		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0			316		23 mm
XC7V1500T-1LFFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array							229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XA6SLX75-3FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0			280		23 mm
XQ6SLX150-L1CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		338			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B484				No		500 MHz		338
XC6SLX25T-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		250		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	250	225 °C (437 °F)	23 mm
XC6SLX150-3NFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	806 MHz				23 mm
XC3S400AN-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	896	CMOS			400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz				23 mm
XC7VX485T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XQ6SLX75T-3FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			268		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0			268		23 mm
XC7V2000T-1FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		100 °C (212 °F)		305400 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XC6SLX100T-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	806 MHz				23 mm
XQ7A200T-L1RS484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	215360	Yes	.98 V	16825	HKMG		285		.95	0.95 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.92 V	.8 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B484			19 mm	No		1098 MHz		285		19 mm
XC7V2000T-1LFFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes		305400							Grid Array					125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XQ6SLX75-1LCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm		e1			328		19 mm
XC7K160T-2LFBG484E	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675			185		0.9		Grid Array	BGA484,22X22,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm		e1		30 s	185	250 °C (482 °F)	23 mm
XC7K160T-L2FBV484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.97 V	12675					.95		Grid Array			.93 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm		e1					23 mm
XC6VLX75T-L1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V		CMOS		240		.9	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC7VX485T-3FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		85 °C (185 °F)		75900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XC7A200T-2SB484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.05 V						1		Grid Array, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm		e0					19 mm
XQ7A200T-1RB484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.35 mm	23 mm	No		1098 MHz		285		23 mm
XA3S1200E-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS			1200000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XQ6SLX75T-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm		e1			292		19 mm
XC7V285T-3FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XQ6SLX75-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		328			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	500 MHz	30 s	328	225 °C (437 °F)
XC6SLX150T-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	806 MHz	30 s	296	225 °C (437 °F)
XA3SD1800A-4CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	309	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	249	260 °C (500 °F)	19 mm
XC6SLX100-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	806 MHz	30 s	326	250 °C (482 °F)	23 mm
XQ7A50T-L1FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	52160	Yes	.98 V	4075	HKMG		250		.95	0.95 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.92 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484	3		23 mm	No	e0	1098 MHz		250		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.