484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX45-1LFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	23 mm
XC6SLX75T-3NCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC7A200T-L1SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		285		.95		Grid Array, Fine Pitch			.92 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm			e1		30 s	285	250 °C (482 °F)	19 mm
XC6SLX45-1LFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	500 MHz				23 mm
XA7A75T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC3S1400A-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC7A200T-L1FBV484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.98 V	16825				.95		Grid Array			.92 V	1 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm			e1					23 mm
XC6SLX100T-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911		296		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC6VLX130T-2FFG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes			CMOS	240			1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B484	4			No		e1	1286 MHz	30 s	240	250 °C (482 °F)
XQ6SLX150-1LFGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519		338		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	338	250 °C (482 °F)	23 mm
XC6SLX45-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411		320		1		Grid Array	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			320		19 mm
XC3S1400AN-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.6 mm	23 mm	No			667 MHz		288		23 mm
XC6SLX45T-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XC3S50AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS		50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	770 MHz	30 s		250 °C (482 °F)	23 mm
XC6VCX130T-2FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6SLX100T-2FGG484I4229	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911		296		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.6 mm	23 mm						296		23 mm
XC6SLX150-N3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	338	250 °C (482 °F)	23 mm
XC6VLX75T-1LFFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	.97 V	5820	CMOS	240				Grid Array	BGA484,22X22,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	5820 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS	240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6SLX100T-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	296	225 °C (437 °F)	23 mm
XC6SLX75T-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	74637	Yes			CMOS	292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	292	225 °C (437 °F)
XC6SLX150T-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XC6SLX150T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS	296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC6SLX100-N3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX75-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	280		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	280	225 °C (437 °F)	23 mm
XC6SLX75-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	74637	Yes			CMOS	328			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	328	225 °C (437 °F)
XC7V585T-1FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		91050						Grid Array							91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XQ6SLX150-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		338		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			338		19 mm
XC6SLX45T-3NFGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XC6SLX45-1LFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	500 MHz				23 mm
XC7V1500T-1FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		229050						Grid Array							229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC6VCX75T-2FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V	5820	CMOS	240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC7A200T-L2SBG484E	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825	CMOS	285		.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	Also Operates at 1 V supply	e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XC6SLX150T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		296		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC6SLX45-3NFGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	23 mm
5CGXFC9C6U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC9F6F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
EP1K10FC484-1P	Altera	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136			2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No		e0			136	220 °C (428 °F)
EP1K10FC484-1F	Altera	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136			2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No		e0			136	220 °C (428 °F)
EP1K100FC484-1P	Altera	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	333			2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No		e0			333	220 °C (428 °F)
5CGXBC4C7F23C8N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	240		1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXBC3B6F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGTFD9F5F23C6	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC5B6F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC7C7U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC4F7F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10M16DFF484I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes								Grid Array										Bottom	S-PBGA-B484
5CGXBC7C7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.