484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP3C40F484I6

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

331

1.2

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B484

1

2.4 mm

23 mm

No

e0

331

23 mm

10AS016C4U19E3SP

Altera

FPGA

Ball

484

FBGA

Square

Plastic

160000

Yes

CMOS

192

.9

0.9 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

192

5CGXFC7A6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEBA6U19A7S

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10AS016C3U19E2LP

Altera

FPGA

Ball

484

FBGA

Square

Plastic

160000

Yes

CMOS

192

.9

0.9 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

192

5CGXBC9C7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD5A5U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC4A6F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC7C6F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4C7U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3D6F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5F6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC4C6U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

50000

Yes

1.13 V

CMOS

240

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

240

19 mm

EP1S10F484C5N

Altera

FPGA

Commercial Extended

Ball

484

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

1200

CMOS

426

1.5

1.5,1.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

1200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

3.5 mm

23 mm

No

e1

426

245 °C (473 °F)

23 mm

EP4CE40F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

2475

331

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

2475 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e0

472.5 MHz

20 s

331

220 °C (428 °F)

23 mm

5CGXBC7A7F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3C80F484I6

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

81264

Yes

1.25 V

CMOS

295

1.2

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B484

1

2.4 mm

23 mm

No

e0

295

23 mm

EP1S30F484I5ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CSEMA2U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9C7F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5F7F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP4CGX30CF23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

29440

Yes

1.24 V

1840

290

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1840 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e0

472.5 MHz

290

23 mm

5CGXFC4D6F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGTFD5A5F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGTFD9E5F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP4CE15F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

963

346

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e0

472.5 MHz

20 s

346

220 °C (428 °F)

23 mm

5CGXFC7E7U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEBA5U19A7S

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C55F484I8

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

CMOS

327

1.2

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B484

1

2.4 mm

23 mm

No

e0

327

23 mm

5CGXFC9C6F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CEBA7F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC7B6M15C7N

Altera

FPGA

Other

Ball

484

LFBGA

Square

Plastic/Epoxy

149500

Yes

1.13 V

5648

CMOS

240

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA484,28X28,20

Field Programmable Gate Arrays

1.07 V

.5 mm

85 °C (185 °F)

5648 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B484

1.25 mm

15 mm

No

240

15 mm

5CGXBC7E6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3B7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4F6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC3A6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4D7F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CEFA2F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC5D7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD9F5F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CEFA9U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP4CGX150CF23

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array

1.16 V

1 mm

47 CLBS

Bottom

S-PBGA-B484

2.4 mm

23 mm

23 mm

5CGXFC5D6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4E7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C40U484I6

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

331

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

Tin Lead

Bottom

S-PBGA-B484

1

2.05 mm

19 mm

No

e0

331

19 mm

EP4CE55U19

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Fine Pitch

1.16 V

.8 mm

47 CLBS

Bottom

S-PBGA-B484

2.05 mm

19 mm

19 mm

5CGXFC7D7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5D7F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.