484 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CSEBA6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

110000

Yes

1.13 V

CMOS

66

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

66

19 mm

5CGXFC3F6F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC9C7F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CEBA4U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10M08DFF484C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

5CGXFC9A6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEFA5F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4A6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA4U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3D6U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEBA2F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP1S20F484C6ES

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CGXFC7A7U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5C7U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC3C7F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CSEMA6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7F7U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5D7F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CEBA9U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1S25F484I6

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CSEBA4U19I7S

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

40000

Yes

1.13 V

CMOS

66

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

66

19 mm

5CGXFC9F7U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC3D6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1S40F484I5ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

EP3C80F484C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

81264

Yes

1.25 V

81264

CMOS

295

1.2

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

81264 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e0

472.5 MHz

20 s

295

220 °C (428 °F)

23 mm

5CSXFC5C6F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5B7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3CLS70F484C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

70208 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.15 mm

23 mm

No

e1

450 MHz

30 s

413

260 °C (500 °F)

23 mm

5CEBA2U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC4E7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC5F7F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CSEMA6U19C6S

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1S30F484I6ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CGXFC9E7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4B7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5A7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA4U19C81

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

40000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CSEMA5U19C82N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

85000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CGXBC4E7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5E7U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1K30FI484-2DX

Altera

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

1728

Yes

CMOS

171

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

No

e0

171

220 °C (428 °F)

5CGXFC9A6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC3C6F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGTFD7B5U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7F7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5B6F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC9D7U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7F7F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.