484 Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXBC3D7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3A7U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5C7U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C55F484A7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

55856

Yes

CMOS

327

1.2/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B484

No

327

10M16DCF484I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B484

5CSEMA2U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3F7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC5E6F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4F6U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7D6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2C35F484C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

33216

Yes

1.25 V

2076

CMOS

322

1.2

1.2,1.5/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

2076 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

Also requires 3.3 V supply

e0

500 MHz

20 s

306

220 °C (428 °F)

23 mm

5CGXFC5B7U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD9B5F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP1S25F484I5ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CGXBC5E6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4F6F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3C40F484I8N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

331

1.2

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B484

2.4 mm

23 mm

No

e1

331

23 mm

5CGXFC7C6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3SE50F484I3

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

296

.9

1.2/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B484

3

3.5 mm

23 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

296

220 °C (428 °F)

23 mm

EP3SL50F484I2LN

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

296

1.2/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

100 MHz

296

5CSEMA6U19C71

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CGTFD9B5F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC7B6F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC3F6F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3SE50F484C2N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

296

.9

1.2/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

3.5 mm

23 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

800 MHz

30 s

296

245 °C (473 °F)

23 mm

10M08DCF484A7G

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

e1

5CGXFC5E6F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC7A6U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD7D5F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC7A7U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5E6F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC4F7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7D7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5D6F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5E7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C16U484C6

Altera

FPGA

Other

Ball

484

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

346

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B484

3

2.2 mm

19 mm

No

e0

472.5 MHz

20 s

346

220 °C (428 °F)

19 mm

5CGTFD5A5F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4D6F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC3D6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC3C6U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7D6U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3CLS150F484

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

47

1.2

Grid Array

1.15 V

1 mm

47 CLBS

Bottom

S-PBGA-B484

2.15 mm

23 mm

23 mm

5CSEBA5U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

85000

Yes

1.13 V

CMOS

66

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

66

19 mm

5CGXBC4B7F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP4CE40F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

2475

328

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

125 °C (257 °F)

2475 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e1

472.5 MHz

328

23 mm

5CGXFC9A7F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4C6U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

50000

Yes

1.13 V

CMOS

224

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

224

19 mm

5CSXFC6C6F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.