559 Field Programmable Gate Arrays (FPGA) 30

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC40150XV-09PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.3 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		225 MHz	448	57.404 mm
XC40150XV-09PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm		1.3 ns	5184 CLBS, 100000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		225 MHz	448	57.404 mm
XC4085XL-1PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.3 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		200 MHz	448	57.404 mm
XC40250XV-7PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS		180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	0.9 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			250 MHz		57.404 mm
XC40250XV-08PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm		1.1 ns	8464 CLBS, 180000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 500000 gates		258 MHz	448	57.404 mm
XC40150XV-8PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS		100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			217 MHz		57.404 mm
XC40125XVPG559	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	4624	CMOS		80000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm			4624 CLBS, 80000 Gates		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No					57.404 mm
XC40250XV-9PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS		180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm		1.2 ns	8464 CLBS, 180000 Gates		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm
XC40250XV-08PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 500000 gates		258 MHz	448	57.404 mm
XC40250XV-07PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 500000 gates		296 MHz	448	57.404 mm
XC40250XV-09PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.3 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 500000 gates		225 MHz	448	57.404 mm
XC4085XL-2PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.5 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		179 MHz	448	57.404 mm
XC40250XV-09PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm		1.3 ns	8464 CLBS, 180000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 500000 gates		225 MHz	448	57.404 mm
XC40150XV-9PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS		100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.2 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm
XC40150XV-7PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS		100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	0.9 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			250 MHz		57.404 mm
XC4085XL-3PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.6 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		166 MHz	448	57.404 mm
XC4085XL-2PG559I	Xilinx	FPGA		Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm		1.5 ns	3136 CLBS, 55000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		179 MHz	448	57.404 mm
XC40150XV-8PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS		100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm		1.1 ns	5184 CLBS, 100000 Gates		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			217 MHz		57.404 mm
XC40150XV-08PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm		1.1 ns	5184 CLBS, 100000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		258 MHz	448	57.404 mm
XC4085XL-3PG559I	Xilinx	FPGA		Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm		1.6 ns	3136 CLBS, 55000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		166 MHz	448	57.404 mm
XC4085XL-1PG559I	Xilinx	FPGA		Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm		1.3 ns	3136 CLBS, 55000 Gates		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		200 MHz	448	57.404 mm
XC40250XV-8PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS		180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm		1.1 ns	8464 CLBS, 180000 Gates		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			217 MHz		57.404 mm
XC4085XL-09CPG559C	Xilinx	FPGA	Other	Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	7448	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		217 MHz	448	57.404 mm
XC40250XV-8PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS		180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			217 MHz		57.404 mm
XC40150XV-07PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		296 MHz	448	57.404 mm
XC40150XV-08PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		258 MHz	448	57.404 mm
XC40250XV-9PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS		180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.2 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm
XC40150XV-9PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS		100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm		1.2 ns	5184 CLBS, 100000 Gates		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm
XC4085XL-09PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Typical gates = 55000-180000		217 MHz	448	57.404 mm
XC4085XL-09PG559I	Xilinx	FPGA		Pin/Peg	559	PGA	Square	Ceramic	3136	No			CMOS	448		3.3	3.3 V	Grid Array	HSPGA559,43X43	Field Programmable Gate Arrays		2.54 mm					Perpendicular	S-XPGA-P559			No		e0	217 MHz	448

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.