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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC40250XV-8PG559C |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 559; Package Code: HIPGA; Package Shape: SQUARE; |
| Datasheet | XC40250XV-8PG559C Datasheet |
| In Stock | 618 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.3 V |
| Package Body Material: | Ceramic, Metal-Sealed Cofired |
| Organization: | 8464 CLBS, 180000 Gates |
| Maximum Combinatorial Delay of a CLB: | 1.1 ns |
| Maximum Seated Height: | 5.334 mm |
| Surface Mount: | No |
| Position Of Terminal: | Perpendicular |
| No. of Terminals: | 559 |
| No. of Equivalent Gates: | 180000 |
| Package Style (Meter): | Grid Array, Heat Sink/Slug, Interstitial Pitch |
| JESD-30 Code: | S-CPGA-P559 |
| Maximum Clock Frequency: | 217 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | HIPGA |
| Width: | 57.404 mm |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 2.7 V |
| Nominal Supply Voltage (V): | 2.5 |
| Technology Used: | CMOS |
| No. of CLBs: | 8464 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Length: | 57.404 mm |
| Form Of Terminal: | Pin/Peg |
| Pitch Of Terminal: | 2.54 mm |









