572 Field Programmable Gate Arrays (FPGA) 209

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2AGX65DF25C4N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz		260		25 mm
EP2AGX65DF25C5N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz		260		25 mm
EP2AGX45DF25I5G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm					260		25 mm
EP2AGX125DF25C4N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	4964 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz		260		25 mm
EP2AGX45DF25C4G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm					260		25 mm
EP2AGX45DF25C6G	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm					260		25 mm
EP2AGX95DF25C4	Intel	FPGA		Ball	572	BGA	Square	Plastic	89178	Yes			CMOS	260		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B572				No				260
EP2AGX95DF25I3N	Intel	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	3747 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm	No	e1	500 MHz		260		25 mm
EP2AGX125DF25C6NES	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy		Yes	.93 V	124100			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	124100 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		3.5 mm	25 mm	No		500 MHz				25 mm
EP2AGX45CF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX65CF25C4N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65FF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX95HF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX125EF25C6	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	4964 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX45DF25C4	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes			CMOS	252		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	252	220 °C (428 °F)
EP2AGX95EF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX65DF25C5	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	60214	Yes			CMOS	252		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	252	220 °C (428 °F)
EP2AGX95CF25C4N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45CF25C6	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX95CF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65DF25I5	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	60214	Yes			CMOS	252		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	252	220 °C (428 °F)
EP2AGX95DF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	93675	CMOS	260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	93675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz	30 s	260	260 °C (500 °F)	25 mm
EP2AGX45DF25C4N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V		CMOS	252	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz	30 s	252	260 °C (500 °F)	25 mm
EP2AGX125EF25C4N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45HF25I5N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45HF25I3N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX125DF25C5NES	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy		Yes	.93 V	124100			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	124100 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.2 mm	25 mm	No		500 MHz				25 mm
EP2AGX45FF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65HF25C6	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX95DF25I5	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes			CMOS	260		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	260	220 °C (428 °F)
EP2AGX45FF25I5	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX125FF25C4N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45CF25I5N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65CF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65HF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45DF25C5	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes			CMOS	252		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	252	220 °C (428 °F)
EP2AGX65HF25I3N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX95DF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX95HF25I5N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX95EF25C6N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX95EF25I3N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX125HF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45CF25I5	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX95CF25C6N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX65EF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX125FF25I3N	Altera	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm		e1	500 MHz				25 mm
EP2AGX45FF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			252		25 mm
EP2AGX125CF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	4964 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.