575 Field Programmable Gate Arrays (FPGA) 42

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V1000-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	328		31 mm
XC2V2000-5BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	408	225 °C (437 °F)	31 mm
XQ2V1000-4BGG575N	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1.27 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz			31 mm
XC2V1500-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	392		31 mm
XQR2V1000-4BGG575R	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz			31 mm
XC2V1000-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	328		31 mm
XC2V1000-5BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1280 CLBS, 1000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	328	225 °C (437 °F)	31 mm
XC2V2000-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	408		31 mm
XC2V1500-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	392		31 mm
XC2V1000-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	328		31 mm
XC2V1500-5BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	392	225 °C (437 °F)	31 mm
XC2V1000-4BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	328	225 °C (437 °F)	31 mm
XC2V1500-6BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	1920 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	392	225 °C (437 °F)	31 mm
XC2V1000-6BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	328		31 mm
XC2V2000-6BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	2688 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	408	225 °C (437 °F)	31 mm
XC2V1500-4BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	392	225 °C (437 °F)	31 mm
XQR2V1000-4BGG575N	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz			31 mm
XC2V1500-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	392		31 mm
XC2V2000-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	408		31 mm
XC2V2000-6BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	408		31 mm
XC2V1000-6BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	1280 CLBS, 1000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	328	225 °C (437 °F)	31 mm
XC2V1000-4BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	328	225 °C (437 °F)	31 mm
XQR2V1000-4BG575N	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	328	225 °C (437 °F)	31 mm
XC2V1000-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	328		31 mm
XC2V1500-5BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	392	225 °C (437 °F)	31 mm
XC2V1000-5BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	328	225 °C (437 °F)	31 mm
XC2V1500-6BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	392	225 °C (437 °F)	31 mm
XQR2V1000-4BG575R	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	328	225 °C (437 °F)	31 mm
XC2V2000-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	408		31 mm
XC2V2000-4BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	408	225 °C (437 °F)	31 mm
XC2V2000-5BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz	408	225 °C (437 °F)	31 mm
XC2V1000-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	328		31 mm
XC2V1500-6BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz	392		31 mm
XC2V2000-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	408		31 mm
XC2V2000-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	408		31 mm
XQ2V1000-4BG575N	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	328	225 °C (437 °F)	31 mm
XC2V1500-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz	392		31 mm
XC2V2000-4BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	408	225 °C (437 °F)	31 mm
XC2V1000-6BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	328	225 °C (437 °F)	31 mm
XC2V2000-6BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	820 MHz	408	225 °C (437 °F)	31 mm
XC2V1500-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz	392		31 mm
XC2V1500-4BG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	650 MHz	392	225 °C (437 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.