668 Field Programmable Gate Arrays (FPGA) 158

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VLX25-12FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VSX35-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	3840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-10FFG668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	448	250 °C (482 °F)
XC4VSX25-10FFG668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	320	250 °C (482 °F)
XC4VFX12-10FF668CS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No	e0	1028 MHz		320
XC4VLX40-11FFG668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B668	4			No	e1	1205 MHz	30 s	448	250 °C (482 °F)
XC4VLX25-11FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		2688 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VFX12-11FFG668IS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1181 MHz	30 s	320	250 °C (482 °F)
XC4VSX25-12FFG668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1205 MHz	30 s	320	250 °C (482 °F)
XC4VLX15-12FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1536	CMOS		1.2		Grid Array			1.14 V	1 mm		1536 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0		30 s		225 °C (437 °F)	27 mm
XC4VLX25-10FFG668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	448	250 °C (482 °F)
XC4VFX12-10FFG668CS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	320	250 °C (482 °F)
XC4VFX12-11FF668CS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm				Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No	e0	1181 MHz		320
XQ4VLX40-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	640	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		4608 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	640	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.