668 Field Programmable Gate Arrays (FPGA) 158

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VFX12-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX60-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VFX12-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX60-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XQ4VLX60-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX15-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX25-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX60-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			3840 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX25-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX40-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX60-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XQ4VLX25-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-10FFG668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	448	250 °C (482 °F)
XC4VFX12-12FF668CS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No	e0	1181 MHz		320
XC4VLX40-10FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XC4VSX35-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XC4VLX60-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX40-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-10FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XC4VLX60-11FFG668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1205 MHz	30 s	448	250 °C (482 °F)
XQ4VLX40-10FFG668I	Xilinx	FPGA	Industrial	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS				Grid Array	BGA668,26X26,40		1.14 V	1 mm	100 °C (212 °F)	0.78 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm							27 mm
XC4VLX25-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XC4VSX25-11FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX25-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-11FFG668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1205 MHz	30 s	448	250 °C (482 °F)
XC4VLX15-11FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1205 MHz	30 s	320	225 °C (437 °F)
XC4VSX25-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	320	225 °C (437 °F)
XC4VFX12-10FFG668IS1	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	320	250 °C (482 °F)
XC4VSX35-10FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	448	225 °C (437 °F)
XC4VLX40-12FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1205 MHz	30 s	448	225 °C (437 °F)
XC4VLX15-10FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1028 MHz	30 s	320	225 °C (437 °F)
XC4VSX25-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2560 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VSX35-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-12FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX40-11FFG668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B668	4			No	e1	1205 MHz	30 s	448	250 °C (482 °F)
XQ4VLX60-10FF668I	Xilinx	FPGA	Industrial	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS		1.2		Grid Array	BGA668,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm		e0	1028 MHz	30 s		225 °C (437 °F)	27 mm
XC4VSX25-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VSX35-11FFG668CS2	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XQ4VLX60-10EF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668				No	e0	1028 MHz		448
XC4VSX35-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			3840 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VFX12-11FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	320	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1181 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VSX35-11FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			3840 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX15-11FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No	e0	1205 MHz	30 s	320	225 °C (437 °F)
XC4VSX25-10FFG668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B668	4			No	e1	1028 MHz	30 s	320	250 °C (482 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.