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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC4VSX35-11FFG668I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Organization: 3840 CLBS; |
Datasheet | XC4VSX35-11FFG668I Datasheet |
In Stock | 367 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 3840 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 2.85 mm |
No. of Inputs: | 448 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 448 |
Position Of Terminal: | Bottom |
No. of Terminals: | 668 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B668 |
Maximum Clock Frequency: | 1205 MHz |
Package Shape: | Square |
Package Code: | BGA |
Width: | 27 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 34560 |
No. of CLBs: | 3840 |
JESD-609 Code: | e1 |
Qualification: | No |
Package Equivalence Code: | BGA668,26X26,40 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 27 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 250 °C (482 °F) |