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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | EP4CE6F17I7N |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256; |
| Datasheet | EP4CE6F17I7N Datasheet |
| In Stock | 5,202 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic/Epoxy |
| Organization: | 392 CLBS |
| Maximum Time At Peak Reflow Temperature (s): | 40 s |
| Maximum Seated Height: | 2.2 mm |
| No. of Inputs: | 179 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 179 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 256 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 472.5 MHz |
| Package Shape: | Square |
| Package Code: | BGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Programmable IC Type: | FPGA |
| Nominal Supply Voltage (V): | 1.2 |
| No. of Logic Cells: | 6272 |
| No. of CLBs: | 392 |
| JESD-609 Code: | e1 |
| Qualification: | No |
| Package Equivalence Code: | BGA256,16X16,40 |
| Finishing Of Terminal Used: | Tin/Silver/Copper |
| Length: | 17 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |
| Power Supplies (V): | 1.2,1.2/3.3,2.5 V |









