672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP7-6FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	1232 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1200 MHz	30 s	396	220 °C (428 °F)	27 mm
XC4VFX20-10FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No	e0	1028 MHz	30 s	320	220 °C (428 °F)
XC2VP4-7FG672C	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes			CMOS	348		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No				348
XC2VP7-7FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1350 MHz	30 s	396	220 °C (428 °F)	27 mm
XC4VFX60-11FFG672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No	e1	1181 MHz	30 s	352	250 °C (482 °F)
XC4VFX60-12FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V	6320	CMOS		1.2		Grid Array			1.14 V	1 mm			6320 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0		30 s		220 °C (428 °F)	27 mm
XC4VFX20-12FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2136	CMOS		1.2		Grid Array			1.14 V	1 mm			2136 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0		30 s		220 °C (428 °F)	27 mm
XC2VP2-5FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	352 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	204	250 °C (482 °F)	27 mm
XC2VP7-5FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	396	250 °C (482 °F)	27 mm
XC2VP2-8FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0		30 s		220 °C (428 °F)	27 mm
XC2VP7-5FF672I4307	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396	1.5		Grid Array	BGA672,26X26,40		1.425 V	1 mm	100 °C (212 °F)	0.36 ns	1232 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2.65 mm	27 mm					396		27 mm
XC2VP7-7FG672C	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes			CMOS	396		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No				396
XC4VFX40-10FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4656 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e1	1028 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX40-11FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX40-12FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V	3888	CMOS		1.2		Grid Array			1.14 V	1 mm			3888 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0		30 s		220 °C (428 °F)	27 mm
XC2VP4-6FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS	348	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	752 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1200 MHz	30 s	348	250 °C (482 °F)	27 mm
XC2VP7-6FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1200 MHz	30 s	396	220 °C (428 °F)	27 mm
XC2VP2-5FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1050 MHz	30 s	204	220 °C (428 °F)	27 mm
XC2VP2-7FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1350 MHz	30 s	204	220 °C (428 °F)	27 mm
5CGXBC5F7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXBA1G4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
EP1SGX10CF672C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	362	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e1		30 s	362	245 °C (473 °F)	27 mm
5CGXFC7F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGTFD7B5F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
10AS027E2F27E1SG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No				240		27 mm
EP1S20B672C7N	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	35 mm	No	e1		30 s	586	260 °C (500 °F)	35 mm
5AGXFA7D4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	242950	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm	No	e1	670 MHz		336		27 mm
EP1S40F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No	e0
5AGXBA7D6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5CGXBC4F7F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
10M25DFF672C8G	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	25000	Yes			CMOS	380	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No	e1			380
5CGXBC5E7F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
EP20K300EFI672-1	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11520	Yes			CMOS	400		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672	3			No				400	220 °C (428 °F)
10M25DCF672C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672
10AS032E2F27E2LP	Altera	FPGA		Ball	672	BGA	Square	Plastic	320000	Yes			CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No				240
5CGXBC7B7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXBA7K4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5AGXMA3G4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz				27 mm
10AX022E3F27I1LG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm							27 mm
5CGXFC9E6F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXMA1K6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
10AS016E3F27E1SG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No				240		27 mm
5AGXBA7D6F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz				27 mm
5CGXFC5E6F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC5B6F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
10AS022E5F27I3SP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		8033 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No				240
5AGXBA1D6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz				27 mm
5AGTMC3G3F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz				27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.