672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4CGX75DF27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	73920	Yes	1.24 V	4620		310	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		4620 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		310		27 mm
LFE2-70SE-5FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500		500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
LFE3-150EA-8FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V			380	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-35EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			310	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	310	250 °C (482 °F)	27 mm
LFE3-35EA-6FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			310	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	310	250 °C (482 °F)	27 mm
5AGXBA1D4F27C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1	622 MHz		416		27 mm
5AGXMA1D4F27C5N	Intel	FPGA	Other	Ball	672	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1			416		27 mm
5AGXMA3D4F27I3	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
5AGXMA3D4F27I3N	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.18 V	5890		416	1.15		Grid Array, Heat Sink/Slug	BGA672,26X26,40		1.12 V	1 mm	100 °C (212 °F)		5890 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm			e1			416		27 mm
5AGXMA3D4F27I5G	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1		Grid Array, Heat Sink/Slug	BGA672,26X26,40		1.07 V	1 mm	100 °C (212 °F)		5890 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2.7 mm	27 mm						416		27 mm
5AGXMA3D4F27I5N	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		5890 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1			416		27 mm
5CEBA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No					336		27 mm
5CEFA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No					336		27 mm
5CGXBC4C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC5C7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC9D7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
EP1S25F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B672	3			No		e1			706
EP2C35F672C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	450 MHz		459		27 mm
EP2C35F672I6N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C35F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C70F672I8	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		406		27 mm
EP2C70F672I8N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		406		27 mm
EP2S15F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	15600	Yes	1.25 V	6240	CMOS	366	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	6240 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		358		35 mm
EP2S60F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	24176 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz	30 s	484	245 °C (473 °F)	35 mm
EP2S60F672I4	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	100 °C (212 °F)	5.117 ns	24176 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No			717 MHz		484		35 mm
EP4CGX110DF27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		393	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		393		27 mm
EP4CGX150DF27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		393	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		393		27 mm
EP4CGX50DF27I7N	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	49888	Yes	1.25 V	49888		310	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		49888 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	310	260 °C (500 °F)	27 mm
LFE2-20SE-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		402	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	402	250 °C (482 °F)	27 mm
LFE2-70E-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500		500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
XC4VFX60-10FF672I	Xilinx	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		6320 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-11FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX60-11FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX60-11FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC2VP2-5FG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes			CMOS	204		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No					204
XC4VFX40-11FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC4VFX60-11FF672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC4VFX40-12FFG672CS1	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	352	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.15 ns	4656 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX20-11FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS	320	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	320	250 °C (482 °F)	27 mm
XC2VP4-7FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS	348	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0	1350 MHz	30 s	348	220 °C (428 °F)	27 mm
XC4VFX40-10FFG672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1028 MHz	30 s	352	250 °C (482 °F)
XC4VFX60-10FFG672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1028 MHz	30 s	352	250 °C (482 °F)
XC2VP2-6FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0	1200 MHz	30 s	204	220 °C (428 °F)	27 mm
XC2VP4-8FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	752	CMOS		1.5		Grid Array			1.425 V	1 mm			752 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0		30 s		220 °C (428 °F)	27 mm
XC4VFX20-12FFG672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes			CMOS	320		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1181 MHz	30 s	320	250 °C (482 °F)
XC4VFX40-12FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC4VFX60-10FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1028 MHz	30 s	352	220 °C (428 °F)
XC2VP2-8FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS		1.5		Grid Array			1.425 V	1 mm			352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0		30 s		220 °C (428 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.