Intel - 5AGXMA3D4F27I3N

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5AGXMA3D4F27I3N by Intel

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Manufacturer Intel
Manufacturer's Part Number 5AGXMA3D4F27I3N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE;
Datasheet 5AGXMA3D4F27I3N Datasheet
In Stock1,036
NAME DESCRIPTION
Minimum Supply Voltage: 1.12 V
Package Body Material: Plastic/Epoxy
Organization: 5890 CLBS
Maximum Seated Height: 2.7 mm
No. of Inputs: 416
Surface Mount: Yes
No. of Outputs: 416
Position Of Terminal: Bottom
No. of Terminals: 672
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B672
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: HBGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.18 V
Nominal Supply Voltage (V): 1.15
No. of Logic Cells: 156000
No. of CLBs: 5890
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA672,26X26,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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