81 Field Programmable Gate Arrays (FPGA) 59

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40LP4K-CM81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm	No	e1	133 MHz	30 s	63	260 °C (500 °F)	4 mm
LCMXO3LF-4300E-5UWG81CTR1K	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
ICE40LP8K-CM81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
ICE40LP8K-CM81TR	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
10M08DFV81I7G	Intel	FPGA	Industrial	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LCMXO3LF-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
AGLN250V2-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	.8 mm	5 mm	No	e1		30 s		260 °C (500 °F)	5 mm
10M08DCV81I7G	Intel	FPGA	Industrial	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LIF-MD6000-6MG81I	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	1500				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm			1500 CLBS		Tin Silver Copper Over Nickel	Bottom	S-PBGA-B81	3	1 mm	4.5 mm						260 °C (500 °F)	4.5 mm
AGLN250V5-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No			30 s		260 °C (500 °F)	5 mm
LCMXO3L-4300E-5UWG81CTR50	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
ICE40LP1K-CM81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	63		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm	No	e1	133 MHz	30 s	63	260 °C (500 °F)	4 mm
10M08DFV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LCMXO3L-4300E-5UWG81CTR1K	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
LCMXO3L-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LCMXO3L-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
ICE40LP4K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
LCMXO3L-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
LCMXO3L-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
10M08DCV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LCMXO3LF-4300E-5UWG81CTR50	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
ICE40LP4K-CM81TR	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
10M08DCV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LCMXO3LF-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
AGLN060V2-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	.8 mm	5 mm	No	e1		30 s		260 °C (500 °F)	5 mm
AGLN125V2-CSG81Y	Microchip Technology	FPGA	Commercial	Ball	81	VFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V	3072	CMOS	60	125000	1.2		1.2/1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No		160 MHz	30 s	60	260 °C (500 °F)	5 mm
LCMXO2-4000ZE-1UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	3.6 V			63		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16		1.14 V	.4 mm	85 °C (185 °F)			-40 °C (-40 °F)		Bottom	R-PBGA-B81		.567 mm	3.693 mm					63		3.797 mm
T8F81C2	Efinix	FPGA		Ball	81	VFBGA	Square	Plastic/Epoxy	7384	Yes	1.15 V		SMIC	55		1.1			Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20		1.05 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B81	3	.93 mm	5 mm					55	260 °C (500 °F)	5 mm
ICE40LP1K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
ICE40LP1K-CB81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	62		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	5 mm	No	e1	133 MHz	30 s	62	260 °C (500 °F)	5 mm
10M08DFV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
AGLN125V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No			30 s		260 °C (500 °F)	5 mm
AGLN250V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		6144 CLBS, 250000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No			30 s		260 °C (500 °F)	5 mm
10M08DAV81C8G	Altera	FPGA	Other	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B81
10M08DFV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
10M08DFV81I7	Altera	FPGA		Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B81
10M08DAV81A7G	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
10M08DCV81A7G	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
10M08DAV81I6G	Altera	FPGA		Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B81
10M08DCV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
10M08DAV81C8	Altera	FPGA	Other	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B81
10M08DAV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
10M08DCV81I7	Altera	FPGA		Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B81
10M08DFV81I6G	Altera	FPGA		Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B81
10M08DCV81C7	Altera	FPGA	Other	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B81
10M08DFV81A7G	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.