896 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V1000-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	432	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	1280 CLBS, 1000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	820 MHz	30 s	432	225 °C (437 °F)	31 mm
XC2VPX20-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1350 MHz	30 s	552	225 °C (437 °F)	31 mm
XC2VP20-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0		30 s		225 °C (437 °F)	31 mm
XC2VPX20-6FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1200 MHz	30 s	552	225 °C (437 °F)	31 mm
XC2VP20-7FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1500-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	750 MHz	30 s	528	225 °C (437 °F)	31 mm
XC2VP7-6FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	1232 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	396	245 °C (473 °F)	31 mm
XC2VP50-5FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	53136	Yes			CMOS	556			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B896	4			No	e0		30 s	556	225 °C (437 °F)
XC2V1500-5FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	750 MHz	30 s	528	225 °C (437 °F)	31 mm
XC2VP50-6FF896C	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	53136	Yes			CMOS	556			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B896	4			No	e0		30 s	556	225 °C (437 °F)
XC2VP30-6FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VPX20-7FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2448	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	2448 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1000-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XC2VP50-5FF896C	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	53136	Yes			CMOS	556			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B896	4			No	e0		30 s	556	225 °C (437 °F)
XC2V2000-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	820 MHz	30 s	624	245 °C (473 °F)	31 mm
XC2V1000-4FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2VP20-7FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1350 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VP50-7FF896C	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	53136	Yes			CMOS	556			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B896	4			No	e0		30 s	556	225 °C (437 °F)
XC2VP20-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP30-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP7-8FF896I	Xilinx	FPGA		Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	1232	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0		30 s		225 °C (437 °F)	31 mm
XC2VP30-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1350 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VPX20-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2448 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	552	245 °C (473 °F)	31 mm
XC2VP30-7FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3424	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	31 mm
XC2VP20-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1200 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VP30-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP7-7FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1350 MHz	30 s	396	225 °C (437 °F)	31 mm
XC2VP7-7FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1350 MHz	30 s	396	245 °C (473 °F)	31 mm
XC2V1500-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	1920 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	820 MHz	30 s	528	225 °C (437 °F)	31 mm
XC2VP20-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP20-8FFG896I	Xilinx	FPGA		Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1		30 s		245 °C (473 °F)	31 mm
XC2V2000-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	750 MHz	30 s	624	225 °C (437 °F)	31 mm
XC2VP50-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	53136	Yes			CMOS	556			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B896	4			No	e0		30 s	556	225 °C (437 °F)
XC2VP30-7FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	3424 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1350 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VP20-8FF896I	Xilinx	FPGA		Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0		30 s		225 °C (437 °F)	31 mm
XC2VP7-5FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1050 MHz	30 s	396	225 °C (437 °F)	31 mm
XC2VP20-7FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1350 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2V1500-4FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1920	CMOS		1500000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1500-4FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	650 MHz	30 s	528	225 °C (437 °F)	31 mm
XC2VPX20-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1050 MHz	30 s	552	225 °C (437 °F)	31 mm
XC2VP30-6FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1200 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VP7-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	396	245 °C (473 °F)	31 mm
XC2V1000-4FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	432	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	650 MHz	30 s	432	225 °C (437 °F)	31 mm
XC2V1500-4FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	650 MHz	30 s	528	225 °C (437 °F)	31 mm
XC2VP30-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	3424 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1200 MHz	30 s	556	225 °C (437 °F)	31 mm
XC2VPX20-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2448 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	1200 MHz	30 s	552	225 °C (437 °F)	31 mm
XC2VP20-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2V2000-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	750 MHz	30 s	624	245 °C (473 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.