896 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXFC7D6F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V	5648	CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		5648 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
5CEBA9F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					480		31 mm
M2GL050-FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	377		1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No				30 s	377	245 °C (473 °F)	31 mm
5CGXFC9E6F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1			Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm			e1					31 mm
M2GL050T-1FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1		30 s	377	245 °C (473 °F)	31 mm
M2GL050T-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No					377		31 mm
EP2C70F896C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	622		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4276 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2.6 mm	31 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	606	260 °C (500 °F)	31 mm
EP4CGX150DF31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		475		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm			9360 CLBS		Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e1	472.5 MHz		475		31 mm
5AGXMB1G4F31C4N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11321 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			704		31 mm
M2S050T-1FGG896	Microchip Technology	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2			Grid Array	BGA896,30X30,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.44 mm	31 mm					40 s	377	250 °C (482 °F)	31 mm
5CEFA9F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1		30 s	488	260 °C (500 °F)	31 mm
5CGTFD7D5F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
RT3PE3000L-1CG896PROTO	Microchip Technology	FPGA		Pin/Peg	896	PGA	Square	Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS		3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-P896		6.75 mm	31 mm								31 mm
M2GL050-FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	377		1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No					377		31 mm
M2S050-FG896I	Microchip Technology	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2			Grid Array	BGA896,30X30,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm					30 s	377	240 °C (464 °F)	31 mm
M2S050-FGG896	Microchip Technology	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2			Grid Array	BGA896,30X30,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.44 mm	31 mm					40 s	377	250 °C (482 °F)	31 mm
5CGXFC7D6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1			Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm			e1		30 s		260 °C (500 °F)	31 mm
5CGXBC9E6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
5CGXFC9E6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	448		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1		30 s	448	260 °C (500 °F)	31 mm
5CEFA7F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	488		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B896		2 mm	31 mm	No					488		31 mm
AX2000-FG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	21504 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz	20 s	684	225 °C (437 °F)	31 mm
EP4CGX110DF31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		475		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e1	472.5 MHz		475		31 mm
XC2VP20-5FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1050 MHz	30 s	556	225 °C (437 °F)	31 mm
5AGXMA3D4F31C5G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416		1.1			Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		5890 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						416		31 mm
5AGXBA1D6F31C6N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			416		31 mm
5AGXBA7D4F31C5N	Intel	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		384		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			384		31 mm
5AGXMA5G4F31C4G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544		1.1			Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		7170 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I3G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.18 V	7170	TSMC	544		1.15			Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.12 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I5G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544		1.1			Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA7G4F31C4N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1	670 MHz		544		31 mm
5AGXMB3G4F31I5	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1			Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
5CEBA7F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					480		31 mm
5CEFA9F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					488		31 mm
5CEFA9F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					488		31 mm
5CGTFD9E5F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	448		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1	622 MHz		448		31 mm
5CGXFC7D6F31C6N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
5CGXFC7D7F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
EP4CGX110DF31C7	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		475		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e0	472.5 MHz		475		31 mm
EP4CGX110DF31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		475		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm			6839 CLBS		Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e1	472.5 MHz		475		31 mm
A3PE3000-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	75264	CMOS		3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e0					31 mm
A3PE3000L-FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	620	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	250 MHz	30 s	620	245 °C (473 °F)	31 mm
AX2000-FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz		684		31 mm
AX2000-FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e1	649 MHz	30 s	684	245 °C (473 °F)	31 mm
M1A3PE3000-1FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	620	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	350 MHz	30 s	620	245 °C (473 °F)	31 mm
XC2V2000-4FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	650 MHz	30 s	624	225 °C (437 °F)	31 mm
XC2V1500-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1920	CMOS		1500000	1.5			Grid Array			1.425 V	1 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XC2V2000-4FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5			Grid Array			1.425 V	1 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2VP7-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	1232 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1350 MHz	30 s	396	225 °C (437 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.