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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AX2000-FG896 |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | AX2000-FG896 Datasheet |
In Stock | 497 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 21504 CLBS, 2000000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 20 s |
Maximum Combinatorial Delay of a CLB: | 0.99 ns |
Maximum Seated Height: | 2.44 mm |
No. of Inputs: | 684 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 684 |
Position Of Terminal: | Bottom |
No. of Terminals: | 896 |
No. of Equivalent Gates: | 2000000 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B896 |
Maximum Clock Frequency: | 649 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 70 °C (158 °F) |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Commercial |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Packing Method: | Tray |
Technology Used: | CMOS |
No. of Logic Cells: | 32256 |
No. of CLBs: | 21504 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA896,30X30,40 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 31 mm |
Form Of Terminal: | Ball |
Additional Features: | 2000000 system gates avaiable |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.5,1.5/3.3,2.5/3.3 V |