Xilinx - XC6VLX760-1FFG1760I

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XC6VLX760-1FFG1760I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6VLX760-1FFG1760I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC6VLX760-1FFG1760I Datasheet
In Stock1,390
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 5.08 ns
Maximum Seated Height: 3.5 mm
No. of Inputs: 1200
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 1200
Position Of Terminal: Bottom
No. of Terminals: 1760
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1760
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 758784
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA1760,42X42,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1,1.2/2.5 V
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