BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CEBA9F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	224	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
XC6SLX25-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	266	250 °C (482 °F)	23 mm
XC6VLX130T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600	1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCKU060-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No		e1		30 s	624	245 °C (473 °F)	35 mm
XCKU095-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			702		35 mm
10CX085YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9			Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									216
10CX220YF780E5G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780									284
EP4CGX75CF23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	73920	Yes	1.24 V	4620		290	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm			4620 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
XC7VX690T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	850	1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No		e1	1818 MHz	30 s	850	245 °C (473 °F)	42.5 mm
XCKU060-2FFVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
10CX220YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188	.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
10M02DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5CGXFC5C6F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
EP3C25F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24624	Yes	2.625 V	24624	CMOS	156	2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		24624 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					156		17 mm
MPF200T-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	244	1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC7S50-1FGGA484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1			Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
XCKU15P-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e1		30 s	668	245 °C (473 °F)	35 mm
10CX105YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M04DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			246		17 mm
5CEBA5F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908		240	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2908 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5C6F27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	368	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	368	260 °C (500 °F)	27 mm
5SGXMA7H3F35C3	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP2C50F672C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	450	1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3158 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		434		27 mm
EP3C16F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
M2GL090T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	267	1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC7K160T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
10M40DCF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
LCMXO2-1200ZE-1MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
M2GL050T-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377	1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No					377		31 mm
XC6SLX100-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480	1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	480	250 °C (482 °F)	27 mm
XC7K70T-1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300	1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S100-L1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	.98 V	8000	HKMG	400	0.95			Grid Array	BGA484,22X22,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
10CL120YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		7443 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M04SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				246		8 mm
EP3C5M164C8N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	106	2.5		1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
LCMXO2-1200HC-6MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			104	2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
XCKU060-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No		e1			624		35 mm
10M25DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DAF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
EP2C70F896C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	622	1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4276 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2.6 mm	31 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	606	260 °C (500 °F)	31 mm
EP3C55F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
LFXP2-17E-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	201	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
XC6VCX195T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600	1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7K410T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	400	1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XCKU040-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520	.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1		30 s	520	245 °C (473 °F)	35 mm
XCKU15P-L2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668	0.72			Grid Array	BGA1156,34X34,40		.698 V	1 mm	110 °C (230 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm		Also Operates at 0.85 V nominal supply	e1			668		35 mm
XCVU3P-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			520		40 mm
XCVU9P-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780		832	0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B2104	4	4.32 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.