BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX330T-3FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No		e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XCV1000E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCVU095-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768			832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2VP50-7FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	5904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	852	225 °C (437 °F)	40 mm
XC7K70T-3FB484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XCV100E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4VLX200-11FF1513IS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1513	4			No		e0	1205 MHz	30 s	960	225 °C (437 °F)
XC4VLX160-12FF1513I	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy		Yes	1.26 V	16896	CMOS				1.2		Grid Array			1.14 V	1 mm			16896 CLBS		Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XCVU160-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	1.03 V	1560			702		1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XC3S200A-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	667 MHz	30 s	192	225 °C (437 °F)	19 mm
XCV50-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS			57906	2.5		Grid Array			2.375 V	1 mm		0.8 ns	384 CLBS, 57906 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XQ5VFX70T-2EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1265 MHz		360		27 mm
XC3S4000-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XA6SLX75-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		AEC-Q100; TS 16949	280		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	280	250 °C (482 °F)	23 mm
XCV300-4BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0					27 mm
XC7K160T-L2FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1286 MHz	30 s	400	225 °C (437 °F)
XC7A35T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC3S200-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1					19 mm
XQKU095-1RFB2104M	Xilinx	FPGA	Military	Ball	2104	BGA	Square	Plastic/Epoxy		Yes		67200					.95		Grid Array					125 °C (257 °F)		67200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B2104						e0
XCV400E-7FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	2400 CLBS, 129600 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	400 MHz	30 s	404	250 °C (482 °F)	27 mm
XC4028XL-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 18000-50000	e1	217 MHz	30 s		250 °C (482 °F)	27 mm
XC6VSX315T-1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6SLX25-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		266		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	266	250 °C (482 °F)	23 mm
XC7VX1140T-L2FLG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS		1100		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	89000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No		e1	1818 MHz		1100		45 mm
XC7K160T-1FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
XQKU095-1RFB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes		67200					.95		Grid Array							67200 CLBS		Tin Lead	Bottom	S-PBGA-B2104						e0
XCS100E-6FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	357 MHz	30 s	202	225 °C (437 °F)	23 mm
XC7V1500T-1LFFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm			229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
DY6009BG432GC	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	256	Yes	3.47 V	256	CMOS		128		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	128	225 °C (437 °F)
XC2VP40-7FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	1350 MHz	30 s		250 °C (482 °F)	27 mm
XA7S50-1FGGA484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	4075		AEC-Q100; TS 16949			1		Grid Array			.95 V	1 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e1	1098 MHz	30 s		250 °C (482 °F)	23 mm
XCKU095-L1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.95 V nominal supply	e1		30 s	702	245 °C (473 °F)	40 mm
XC7K420T-1FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	CMOS		350		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	350	245 °C (473 °F)	31 mm
XC7VX330T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS		650			1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		650
XC4036XLA-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 65000 gates	e1					27 mm
XC7A200T-2FBV484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array			.95 V	1 mm		1.05 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm			e1					23 mm
XC7A350T-L2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	348480	Yes	.93 V		CMOS		600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4		35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7V285T-2FFG784I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No		e1		30 s		245 °C (473 °F)
XCS100E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		202		17 mm
XC7A8-1FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	8000	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
XA6SLX45T-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	296	250 °C (482 °F)
XC7A35T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS		250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm		0.94 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1412 MHz	30 s	250	250 °C (482 °F)	23 mm
5962-9851301NUA	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e0	166 MHz				27 mm
XC5VFX30T-2FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC4VFX40-10FFG672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS		352			1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1028 MHz	30 s	352	250 °C (482 °F)
XCV1000E-7FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e0	400 MHz	30 s	512	225 °C (437 °F)	40 mm
XC7A15-1FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
XC4VFX140-12FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		896		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1181 MHz	30 s	896	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.