BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V6000-5BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		684	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	750 MHz	30 s	684	245 °C (473 °F)	40 mm
XC4VLX40-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS		448					Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC7A15-1FTG256C	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1		1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns		0 °C (32 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
XC4VLX25-11FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC6VLX550T-2FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		840		1		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC7VX550T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		350		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC6VLX195T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7VX415T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG		600		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XCKU040-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920	CMOS		520		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1		30 s	520	245 °C (473 °F)	35 mm
XA3S1600E-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	304	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC7K480T-2FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS		400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC7K325T-3FB900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS		500				1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCV50-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		176	57906	2.5		1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	333 MHz	30 s	176	225 °C (437 °F)	17 mm
XC5VLX155T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			680		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	680	225 °C (437 °F)	42.5 mm
XC4VLX160-10FF1148CS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	152064	Yes			CMOS		768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1148	4			No		e0	1028 MHz	30 s	768	225 °C (437 °F)
XC2V1000-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		432	1000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	750 MHz	30 s	432	225 °C (437 °F)	31 mm
XC2V500-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		172	500000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	768 CLBS, 500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC3S4000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS		712	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XCVU080-H1FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714			832		0.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	47.5 mm
XCV150-5BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5			Grid Array			2.375 V	1.27 mm		0.7 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XQR2V1000-4FGG456N	Xilinx	FPGA	Military	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5			Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s		250 °C (482 °F)	23 mm
XCE7VX980T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG		720		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm			e1		30 s	720	245 °C (473 °F)	45 mm
XC7K160T-L2FB484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		285				0.9,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484				No		e0	1286 MHz		285
XQ6VLX240T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241000	Yes	1.05 V	18840	CMOS		600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.67 ns	18840 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A12T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC6VHX250T-2FFG1154E	Xilinx	FPGA		Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes			CMOS		320				1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1154	4			No		e1	1286 MHz	30 s	320	245 °C (473 °F)
XC4VFX40-11FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS		448				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1181 MHz	30 s	448	225 °C (437 °F)
XC7VX485T-2FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1			Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC2S300E-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		329	93000	1.8		1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1536 CLBS, 93000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	329	225 °C (437 °F)	23 mm
XC2VP40-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		692		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2S200-5FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864				200000	2.5			Grid Array			2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XCV1600E-7FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		512	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XC6VLX365T-1LFF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.93 V									Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0					35 mm
XC6VHX250T-3FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS		320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1412 MHz		320		35 mm
XC2V4000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	912	225 °C (437 °F)	40 mm
XC6SLX150-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		498		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	498	250 °C (482 °F)	27 mm
XQKU040-2RSA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes		30300					.95			Grid Array				1 mm			30300 CLBS		Tin Lead	Bottom	S-PBGA-B676		3.44 mm	27 mm			e0					27 mm
XC6VLX130T-2FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		400		1		1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XQ7K325T-1RF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG		400		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25475 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XC5VLX50-2FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220		1		1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC5VLX50T-2FFV1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600			480		1			Grid Array	BGA1136,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	480	245 °C (473 °F)	35 mm
XC5VLX330T-2FFV1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			960		1			Grid Array	BGA1738,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XCE7K325T-1FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1			Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC4020XLA-8BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3			Grid Array			3 V	1.27 mm		1 ns	784 CLBS, 13000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	263 MHz				27 mm
XQ2VP70-5EF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy		Yes	1.575 V	8272	CMOS				1.5			Grid Array			1.425 V	1 mm		0.36 ns	8272 CLBS		Tin Lead	Bottom	S-PBGA-B1704		3.45 mm	42.5 mm			e0					42.5 mm
XC6VHX380T-1FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		720		1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		720		45 mm
XCV300E-7FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		176	82944	1.8		1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XCV3200E-8CGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.89 V	16224	CMOS			876096	1.8			Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.4 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e1	416 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.