BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU19P-L1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300			540		0.72		Grid Array	BGA1760,42X42,40		.698 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XC6VSX315T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XCE7K420T-1FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG		380		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC6VHX255T-1FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS		480		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		480		45 mm
XC7A75T-L2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XCV200-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		176	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.8 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	250 MHz	30 s	176	225 °C (437 °F)	17 mm
XC5VLX110-2FF1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm
XC7V855T-1LFFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XCVU5P-1FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCV600E-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	444	225 °C (437 °F)	27 mm
XC3S1400AN-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	21 mm
XCE7K410T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG		400		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC7A75T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XC5VLX20T-2FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	1560 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0		30 s	172	225 °C (437 °F)	19 mm
XC7V1500T-2FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm			229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XCKU5P-L2FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	27 mm
XA6SLX75-3FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	408			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No		e0	862 MHz	30 s	408	225 °C (437 °F)
XC7V1500T-1FFG784C	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array							229050 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XCVU13P-2FHGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
XCVU9P-1FLGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	47.5 mm						832		47.5 mm
XC2S200E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS		289	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	23 mm
XC2S100E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	600				37000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	600 CLBS, 37000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 100000	e0	357 MHz				27 mm
XQ7V585T-1RF1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	45525 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm			e0			600		35 mm
XC7K325T-L2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XCKU060-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.927 V	2760			624		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	624	245 °C (473 °F)	35 mm
XC5VLX20T-1FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e1		30 s	172	250 °C (482 °F)	19 mm
XC4VLX60-11FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No		e0	1205 MHz	30 s	448	225 °C (437 °F)
XC4VLX60-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC6SLX75T-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	320	250 °C (482 °F)	27 mm
XQ5VSX50T-1EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1098 MHz		360		27 mm
XQ4VLX60-10EFG668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA668,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
XC5VSX50T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	4080 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC4VLX100-11FF1148IS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1148	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XCVU7P-3FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.927 V	98520			832		0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7A15-3FTG256E	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns		0 °C (32 °F)		Bottom	S-PBGA-B256			17 mm	No			1412 MHz		170		17 mm
XCVU095-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			832		0.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7K325T-2FB900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e0	1818 MHz	30 s	500	225 °C (437 °F)	31 mm
XC7A100T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC5VLX110-2FF1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm
XC5VLX110T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC4VLX160-11FFG1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS		960		1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e1	1205 MHz	30 s	960	245 °C (473 °F)	40 mm
XC6SLX45-L1FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		358		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	358	225 °C (437 °F)	27 mm
XC7V855T-1LFFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC4013XLA-9BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	227 MHz				27 mm
XC5VLX50T-2FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600			360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC4VLX40-12FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC6VLX240T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1286 MHz	30 s	720	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.