BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AX2000-FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e1	649 MHz	30 s	684	245 °C (473 °F)	31 mm
M1A3PE3000-1FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	620	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	350 MHz	30 s	620	245 °C (473 °F)	31 mm
M1AFS600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
M2GL010TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V		CMOS	233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	233	250 °C (482 °F)	23 mm
M2GL050TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	200		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm	No				20 s	200	240 °C (464 °F)	11 mm
M2GL060TS-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm					30 s		260 °C (500 °F)	11 mm
M2GL090-FG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL090-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s	425	225 °C (437 °F)	27 mm
M2GL090T-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No				30 s	425	250 °C (482 °F)	27 mm
M2GL090TS-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2S005-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			209		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	209	250 °C (482 °F)	23 mm
M2S025TS-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S050T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
M2S050T-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S060-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S060TS-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090-1FG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s	425	240 °C (464 °F)	27 mm
M2S090-FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
M2S090-FGG676	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
M2S090-FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
M2S090T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
M2S150-1FCS536I	Microchip Technology	FPGA		Ball	536	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	293		1.2	Tray	1.2 V	Grid Array	BGA536,30X30,20	Field Programmable Gate Arrays	1.14 V		100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B536				No		e0		30 s	293	240 °C (464 °F)
M2S150T-1FC1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1152		2.9 mm	35 mm	No		e0		30 s	574	240 °C (464 °F)	35 mm
M2S150T-1FCG1152	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
M2S150TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
M2S150TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
XCVU160-H1FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	115800		702		0.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		115800 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm		Also Operates at 1 V nominal supply				702		47.5 mm
XQ6VLX240T-1LRF784M	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes		18840	CMOS	400					Grid Array	BGA784,28X28,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784		3.17 mm	29 mm			e0			400		29 mm
XC3S50AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS		50000	1.2			Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC2S600E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	514	210000	1.8		1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	3456 CLBS, 210000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 600000	e0	357 MHz	30 s	514	225 °C (437 °F)	23 mm
XC6SLX150-L1FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	338		1		1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	338	225 °C (437 °F)	23 mm
XC4VFX60-11FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	352				1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC6SLX100T-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	376	225 °C (437 °F)	27 mm
XC7V585T-1FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array							91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC2V3000-5BGG728I	Xilinx	FPGA		Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	516	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e1	750 MHz		516		35 mm
XC4010E-4BGG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.5 V	400	CMOS		7000	5			Grid Array			4.5 V	1.5 mm		2.7 ns	400 CLBS, 7000 Gates		Tin Silver Copper	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e1	111 MHz				27 mm
XC7K355T-2FF901I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	356160	Yes			CMOS	300				1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	300	225 °C (437 °F)
XC2V250-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	200	250000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	384 CLBS, 250000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	750 MHz	30 s	200	250 °C (482 °F)	23 mm
XC7V450T-2FFG1157I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ5VFX70T-2EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS	640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1265 MHz		640		35 mm
XCKU085-3FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1		1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCE7K410T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm						400		27 mm
XC6VSX315T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7VX690T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150				1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s		245 °C (473 °F)	45 mm
XC7A200T-1FBV484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825				1			Grid Array			.95 V	1 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm			e1		30 s		250 °C (482 °F)	23 mm
XC6VCX195T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3S1000L-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	221	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s	221	225 °C (437 °F)	19 mm
XC5VFX100T-1FFG1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	680		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.