BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VFX100-11FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768	1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1181 MHz	30 s	576	245 °C (473 °F)	40 mm
XC4VFX60-10FF672I	Xilinx	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		6320 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-10FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576	1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1028 MHz	30 s	576	245 °C (473 °F)	35 mm
XC4VFX60-11FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VFX60-11FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352	1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VLX100-10FF1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	960	1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		12288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No	e0	1028 MHz	30 s	960	225 °C (437 °F)	40 mm
XC4VLX100-11FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	768	1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			12288 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e1	1205 MHz	30 s	768	245 °C (473 °F)	35 mm
XC4VLX25-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX40-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX60-10FFG1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	640	1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e1	1028 MHz	30 s	640	245 °C (473 °F)	35 mm
XC4VLX60-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448	1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VSX55-10FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640	1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6144 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VSX55-11FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640	1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6144 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC5VFX200T-1FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	196608	Yes	1.05 V	15360	CMOS	960	1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	15360 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No	e1		30 s	960	245 °C (473 °F)	42.5 mm
XC5VFX70T-1FFG665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS	360	1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	5600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1		30 s	360	250 °C (482 °F)	27 mm
XC5VLX110T-1FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		640	1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No	e0		30 s	640	225 °C (437 °F)	35 mm
XC5VLX220T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		680	1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No	e0		30 s	680	225 °C (437 °F)	42.5 mm
XC5VLX30-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400	1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1		30 s	400	250 °C (482 °F)	27 mm
XC5VLX50-1FF1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		560	1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No	e0		30 s	560	225 °C (437 °F)	35 mm
XC5VLX50-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		440	1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1		30 s	440	250 °C (482 °F)	27 mm
XC5VLX50T-1FF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		360	1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e0		30 s	360	225 °C (437 °F)	27 mm
XC5VLX50T-3FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		360	1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1		30 s	360	250 °C (482 °F)	27 mm
XC5VSX50T-1FF665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS	360	1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	4080 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e0		30 s	360	225 °C (437 °F)	27 mm
XC5VSX50T-1FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS	360	1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	4080 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1		30 s	360	250 °C (482 °F)	27 mm
XC6SLX100-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	862 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX100T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	296	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XC6SLX150-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	498	250 °C (482 °F)	27 mm
XC6SLX150-2FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	570	1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	667 MHz	30 s	570	250 °C (482 °F)	31 mm
XC6SLX150-L1FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	576	1	1,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1		30 s	576	250 °C (482 °F)	31 mm
XC6SLX150T-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	296	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	296	225 °C (437 °F)	23 mm
XC6SLX25-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	862 MHz	30 s	266	225 °C (437 °F)	23 mm
XC6SLX45-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	358	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	358	250 °C (482 °F)	27 mm
XC6SLX45-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411		316	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0		30 s	316	225 °C (437 °F)	23 mm
XC6SLX45-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	358	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	862 MHz	30 s	358	225 °C (437 °F)	27 mm
XC6SLX45-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	358	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	862 MHz	30 s	358	250 °C (482 °F)	27 mm
XC6SLX75-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6VLX130T-1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	400	1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No	e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX130T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX130T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	400	1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX240T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX240T-L1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V		CMOS	400	.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX550T-2FFG1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes			CMOS	840		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4			No	e1	1286 MHz	30 s	840	245 °C (473 °F)
XC6VLX75T-2FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS	240	1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1286 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX75T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS	240	1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VSX475T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.