BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU19P-3FFVJ1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.927 V	105300		540	0.9		Grid Array	BGA1760,42X42,40		.873 V	1 mm	100 °C (212 °F)		105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU5P-1FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCKU9P-2FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260		304	0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		34260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCVU065-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	1.03 V	600		520	1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCVU095-2FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU13P-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832	0.85		Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						832		52.5 mm
XCVU13P-2FHGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.24 mm	52.5 mm			e1			832		52.5 mm
XCVU13P-3FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000		832	0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm						832		52.5 mm
XCVU440-1FLGA2892C	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880		1456	.95		Grid Array	BGA2892,54X54,40		.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU440-1FLGB2377C	Xilinx	FPGA	Other	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880		1456	.95		Grid Array	BGA2377,49X49,40		.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm			e1			1456		50 mm
XCVU5P-1FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-1FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XQ5VSX95T-1EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS	640	1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
XQ6SLX150-2FG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	338		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	338	225 °C (437 °F)
XQ6SLX75-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V		CMOS	280	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.26 ns			Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	280	225 °C (437 °F)	23 mm
XQ6SLX75T-3FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	268		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	268	225 °C (437 °F)
XQ7A50T-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	52160	Yes	1.05 V	4075	HKMG	250	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		23 mm	No		e0	1286 MHz	30 s	250	225 °C (437 °F)	23 mm
XQ7K325T-1RF676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG	400	1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25475 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XQ7K325T-2RF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG	400	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XQ7K410T-1RF900M	Xilinx	FPGA	Military	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500	1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	31775 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B900		3.44 mm	31 mm			e0			500		31 mm
10AT090S2F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962		624	.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 VCC nominal				624		45 mm
10AX027E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	360	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX027H2F35E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
10AX027H4F35E3LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
10AX032E2F29E1SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990		384	0.9	0.9 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply				384		29 mm
10AX032H2F35E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
10AX032H4F35I3SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
10AX048H2F34E2LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX048H2F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX048H2F34I2LG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX048H2F34I2SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX048H4F34I3LG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
10AX048H4F34I3SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
10AX048K3F35E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	396	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				396		35 mm
10AX057H3F34I2LG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX057K4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
10AX066H2F34I2SGES	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
10AX066N2F40E1HG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm						588		40 mm
10AX090R4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	342	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No					342		40 mm
10AX090S3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				624		45 mm
10AX090U2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	480	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				480		45 mm
10AX115N2F40E2LG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	600	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				600		40 mm
10AX115N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10AX115N3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10AX115R2F40I2SGES	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
10AX115R4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	342	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No					342		40 mm
10AX115U2F45I2SGES	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.