BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX115U3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	480	0.9		0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				480		45 mm
10M02DCU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
10M08DAF484C7G	Intel	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm	No		e1			250		23 mm
10M08DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M08DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			250		17 mm
10M16DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
1SG280LU2F50E2VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		736				Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
5AGXBA3D4F27C4N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890		416	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		5890 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1	670 MHz		416		27 mm
5AGXMA5G4F35C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170		544	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		7170 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	670 MHz		544		35 mm
5CGTFD5C5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGTFD9E5F35I7N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11356 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
5CGXBC3B6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31500	Yes	1.13 V		CMOS	208	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					208		23 mm
5CGXFC7C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5SGXEA7N2F45C2	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	840	.9		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEA7N2F45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	840	.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
EP1AGX90EF1152I6	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	90220		538	1.2		1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm			90220 CLBS			Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			640 MHz		538		35 mm
EP1C12F324C8N	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5		1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1	275 MHz		249		19 mm
EP1S10F672C7	Intel	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			426		27 mm
EP1S30F1020C6N	Intel	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5		1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1			726		33 mm
EP2AGX125EF29I5	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes			CMOS	372			0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					372
EP2C50F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	294	1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3158 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		278		23 mm
EP2SGX60EF1152C3	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e0	717 MHz		534		35 mm
EP3C16U256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	15408	Yes	2.625 V	15408	CMOS	168	2.5		1.2/3.3 V	Grid Array	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		15408 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					168		17 mm
EP3C40F324C6N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
EP3C40F484C6	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		331		23 mm
EP3SL110F1152C4G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		744	0.9			Grid Array	BGA1152,34X34,40		.86 V	1 mm	85 °C (185 °F)		4300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm		It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP3SL50F780C2N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL50F780C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9			Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP4CE40F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		535	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP4CGX75DF27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	73920	Yes	1.24 V	4620		310	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		4620 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		310		27 mm
EP4SGX180FF35C3G	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030		564	0.9			Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		7030 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm						564		35 mm
EP4SGX230KF40C2G	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120		744	.9			Grid Array	BGA1517,39X39,40		.87 V	1 mm	85 °C (185 °F)		9120 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
EP4SGX530KH40C4NES	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248			.9			Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
LCMXO2-2000HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	2112	Yes	3.465 V			104	2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000HE-5MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LFE2-12E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-20E-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		193	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-6E-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6000	Yes	1.26 V	750		190	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	190	250 °C (482 °F)	17 mm
LFE2-6E-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6000	Yes	1.26 V	750		190	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	190	250 °C (482 °F)	17 mm
LFE2-70SE-5FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500		500	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
LFE2M100E-6FN900I	Lattice Semiconductor	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	100000	Yes	1.26 V			416	1.2		1.2 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	357 MHz	40 s	416	250 °C (482 °F)	31 mm
LFE2M35E-6FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4250		140	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE2M35E-7FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4250		303	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	420 MHz		303	250 °C (482 °F)	23 mm
LFE3-150EA-7FN1156I	Lattice Semiconductor	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V			586	1.2		1.2 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	420 MHz	30 s	586	250 °C (482 °F)	35 mm
LFE3-150EA-8FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-35EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			310	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	310	250 °C (482 °F)	27 mm
LFE3-35EA-6FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			310	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	310	250 °C (482 °F)	27 mm
LFXP2-17E-5FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	358	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		358	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.