BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1C6F256I7	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP1S10F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			426		29 mm
EP1S20F780C6N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1			586		29 mm
EP1S25F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B672	3			No		e1			706
EP1S30F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			726		29 mm
EP1S60F1508C7N	Intel	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		6570 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1			1022		40 mm
EP1SGX25FF1020C7N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1			607		33 mm
EP1SGX40DF1020C5N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1			624		33 mm
EP1SGX40DF1020C6	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	638	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			638		33 mm
EP2AGX125EF35C5	Intel	FPGA		Ball	1152	BGA	Square	Plastic	118143	Yes			CMOS	452		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					452
EP2AGX95DF25C4	Intel	FPGA		Ball	572	BGA	Square	Plastic	89178	Yes			CMOS	260		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B572				No					260
EP2C15AF484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			903 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		307		23 mm
EP2C35F672C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	450 MHz		459		27 mm
EP2C35F672I6N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C35F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C70F672I8	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		406		27 mm
EP2C70F672I8N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		406		27 mm
EP2S130F780I4N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	6627	CMOS	534	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	6627 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz		526		29 mm
EP2S15F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	15600	Yes	1.25 V	6240	CMOS	366	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	6240 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		358		35 mm
EP2S60F1020C3N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	718	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	24176 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1	717 MHz		710		33 mm
EP2S60F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	24176 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz	30 s	484	245 °C (473 °F)	35 mm
EP2S60F672I4	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	100 °C (212 °F)	5.117 ns	24176 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No			717 MHz		484		35 mm
EP2SGX130GF1508I4N	Intel	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	132540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1	717 MHz		734		40 mm
EP2SGX60DF780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz		364		29 mm
EP2SGX60DF780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz	30 s	364	245 °C (473 °F)	29 mm
EP2SGX60EF1152C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP3C10M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	106	2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B164	3			No		e1			106
EP3C120F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP3C16F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	15408	Yes	2.625 V	15408	CMOS	168	2.5	1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		15408 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					168		17 mm
EP3C16F484C6	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP3C40F324A7	Intel	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2	1.2/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm			39600 CLBS			Bottom	S-PBGA-B324		1.9 mm	19 mm	No					195		19 mm
EP3C40F324C7N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
EP3C40F484A7N	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	2.625 V	39600	CMOS	331	2.5	1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1			331		23 mm
EP3C40F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		331		23 mm
EP3C40F780I7	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		535		29 mm
EP3C55F484C6	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP3C80F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
EP3CLS200F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	198464	Yes	1.25 V	198464	CMOS	210	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		198464 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.15 mm	23 mm	No		e1	450 MHz		210		23 mm
EP3SE80F1152C3G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744	0.9		Grid Array	BGA1152,34X34,40		.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm		It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200			.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm		Also Operates at 1.1 V VCC nominal						29 mm
EP3SL110F780I4N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		4300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL150F780I4N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		5700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780	3	3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL200F1152I4N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	200000	Yes	.94 V	8000		744	0.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		8000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP3SL340F1517C3NES	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.94 V	13500			.9		Grid Array			.86 V	1 mm	85 °C (185 °F)		13500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.7 mm	40 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz				40 mm
EP3SL340F1760C2	Intel	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS	1120	.9	1.2/3.3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1760		3.9 mm	42.5 mm	No	It can also operate from 1.05 to 1.15 V supply		800 MHz		1120		42.5 mm
EP3SL50F780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply		717 MHz		488		29 mm
EP3SL50F780I4LN	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm						Bottom	S-PBGA-B780		3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply		717 MHz		488		29 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488	0.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	100 °C (212 °F)		2700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.