BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU440-3FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	2880			1456		1			Grid Array	BGA2892,54X54,40		.97 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU7P-2FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU9P-2FSGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm						832		47.5 mm
XCVU9P-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.927 V	147780			832		0.9			Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XQ4VLX25-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XQ4VSX55-10FF1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS		640		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6144 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XQ5VFX130T-2EF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	131072	Yes	1.05 V	11200	CMOS		840		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1265 MHz		840		42.5 mm
XQ7A200T-1RB484M	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.35 mm	23 mm	No			1098 MHz		285		23 mm
XQ7VX690T-1RF1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	HKMG		850		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm			e0			850		42.5 mm
XQ7VX690T-2RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	693120	Yes	1.03 V	54150	HKMG		350		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XQKU040-1RBA676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.979 V	30300					.95			Grid Array			.922 V	1 mm	125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B676	4	3.44 mm	27 mm			e0		5 s		250 °C (482 °F)	27 mm
XQKU060-1RFA1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes		41460			520		.95			Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQKU060-2RFA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes		41460			520		.95			Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQZU11EG-1FFRC1760M	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85			Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XQZU9EG-1FFRB1156M	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260					0.85			Grid Array			.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm			e0		40 s		245 °C (473 °F)	35 mm
A3PE1500-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
M2GL060-FCSG325	Microchip Technology	FPGA	Other	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325	3		11 mm					30 s		260 °C (500 °F)	11 mm
M2S060T-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
A3P1000-1FG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	177	1000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz		177		17 mm
A3P1000-2FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
A3P1000-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3P1000L-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		177	1000000	1.2		1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz		177		17 mm
A3P250-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P600-1FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5			Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-1FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s		225 °C (437 °F)	27 mm
A3PE1500-2FG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0					27 mm
A3PE1500-2FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s		225 °C (437 °F)	27 mm
A3PE1500-2FGG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
A3PE1500-2FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
A3PE3000-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0					23 mm
A3PE3000-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e0					31 mm
A3PE3000-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
A3PE3000-2FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s		225 °C (437 °F)	23 mm
A3PE3000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
A3PE3000L-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	341	225 °C (437 °F)	23 mm
A3PE3000L-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		620	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	250 MHz	30 s	620	245 °C (473 °F)	31 mm
A3PE600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
A3PE600L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		270	600000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		13824 CLBS, 600000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		270		23 mm
AGL1000V5-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		300	1000000	1.5			Grid Array	BGA484,22X22,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s	300	250 °C (482 °F)	23 mm
AGL400V5-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS		178	400000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e0		20 s	178	225 °C (437 °F)	17 mm
APA450-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS		344	450000	2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e0	180 MHz		344		25 mm
AX1000-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	18144	Yes	1.575 V	12096	CMOS		516	1000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.74 ns	12096 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	1000000 system gates avaiable	e1	870 MHz	30 s	516	250 °C (482 °F)	27 mm
AX2000-FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS		684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz		684		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.