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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | M2GL060-FCSG325 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | M2GL060-FCSG325 Datasheet |
| In Stock | 310 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | Plastic/Epoxy |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Supply Voltage: | 1.26 V |
| Nominal Supply Voltage (V): | 1.2 |
| Packing Method: | Tray |
| Surface Mount: | Yes |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 325 |
| Package Style (Meter): | Grid Array |
| Length: | 11 mm |
| JESD-30 Code: | S-PBGA-B325 |
| Form Of Terminal: | Ball |
| Package Shape: | Square |
| Pitch Of Terminal: | .5 mm |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | BGA |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |
| Width: | 11 mm |
| Moisture Sensitivity Level (MSL): | 3 |









