BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7K410T-2FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		500		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm						500		31 mm
XC2S100-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4028XL-1BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1024 CLBS, 18000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 28000 Logic gates	e0	200 MHz	30 s	256	225 °C (437 °F)	27 mm
XC2VP7-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	1232 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1350 MHz	30 s	396	225 °C (437 °F)	31 mm
XC5VLX85-3FFG1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			560		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e1		30 s	560	245 °C (473 °F)	35 mm
XC5VSX50T-2FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	4080 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC6SLX100T-N3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		498		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		498		31 mm
XC2S300E-6FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536				93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e1	357 MHz				27 mm
XC2VP2-5FG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes			CMOS		204			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No					204
XCV400-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	27 mm
XQ7K325T-L2RF900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475	HKMG		500		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		3.44 mm	31 mm						500		31 mm
XC6VLX365T-L1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS		720		.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC2VP20-7FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.28 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	1350 MHz	30 s	404	225 °C (437 °F)	27 mm
XQ6VSX315T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	24600	CMOS				1		Grid Array			.95 V	1 mm	85 °C (185 °F)	0.67 ns	24600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XCV1600E-7FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	400 MHz		724		35 mm
XC4013E-2BGG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	1.5 mm		1.6 ns	576 CLBS, 10000 Gates		Tin Silver Copper	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	125 MHz				27 mm
XC2V1000-6FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		432	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	1280 CLBS, 1000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	820 MHz	30 s	432	225 °C (437 °F)	31 mm
XC6VLX550T-1LFF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V	42960	CMOS		1200		0.9		Grid Array	BGA1760,42X42,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	42960 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm			e0			1200		42.5 mm
XC3S2000-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	5120 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XCV200E-8FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	416 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2VP2-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		156		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	352 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1050 MHz	30 s	156	250 °C (482 °F)	23 mm
XCVU125-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200			884		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCKU095-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC4VFX140-12FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	768	225 °C (437 °F)	40 mm
XC7K70T-1FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XC7A200T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array			.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.1 mm	35 mm			e1					35 mm
XC6SLX100T-3FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		490		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	490	225 °C (437 °F)	31 mm
XQ6VLX240T-1RFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	18840 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC2V6000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XA6SLX9-2FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0	62.5 MHz	30 s	186	225 °C (437 °F)
XC7K480T-2FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS		380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC7VX690T-1FF1926C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS		720			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC4052XLA-07BG560I	Xilinx	FPGA		Ball	560	BGA	Square	Plastic/Epoxy	1936	Yes			CMOS		352		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B560	3			No		e0	294 MHz	30 s	352	225 °C (437 °F)
XC4VFX40-11FF672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS		352			1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XCE7K325T-2FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm		0.61 ns	25475 CLBS			Bottom	S-PBGA-B676		3.37 mm	27 mm								27 mm
XC7V585T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array				1 mm	125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC6VLX130T-1LFFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS		240				Grid Array	BGA484,22X22,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XCV600E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XC2VPX20-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS		552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1350 MHz	30 s	552	225 °C (437 °F)	31 mm
XC7VX550T-2FF1927I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS		600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC3S1400AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B484		2.6 mm	23 mm	No			770 MHz		288		23 mm
XC6VCX130T-1FF484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC2V3000-4BG728I	Xilinx	FPGA		Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	650 MHz		516		35 mm
XCV150-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	23 mm
XCKU115-3FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520			832		1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XCE7V585T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	45525 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XA3S100E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XC4013XL-1BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	200 MHz	30 s	192	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.