BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5VLX110-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1		1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC4VFX20-10FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2			Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX40-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC6VHX565T-3FFG1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V	44280	CMOS		640		1			Grid Array	BGA1924,44X44,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	44280 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm			e1		30 s	640	245 °C (473 °F)	45 mm
XCKU115-1LFLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS		338		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	338	245 °C (473 °F)	40 mm
XC7VX415T-3FFG1927I	Xilinx	FPGA	Industrial	Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG		600		1			Grid Array	BGA1927,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.75 mm	45 mm			e1			600		45 mm
XC6SLX100-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XC7VX485T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XCVU27P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000			676		0.9			Grid Array	BGA2577,51X51,40		.873 V	1 mm	100 °C (212 °F)		162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XC6VLX130T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XCKU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XA3S1600E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XCV600-4FG600I	Xilinx	FPGA		Ball	600	BGA		Plastic/Epoxy	15552	Yes			CMOS		404				1.2/3.6,2.5 V	Grid Array	BGA600(UNSPEC)	Field Programmable Gate Arrays								Bottom					No					404
XC2S400E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8		1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 400000	e0	357 MHz	30 s	410	240 °C (464 °F)	17 mm
XC6SLX150T-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC3S4000-5FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes			CMOS		633				1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0		30 s	633	225 °C (437 °F)
XCVU125-L1FLVB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200					.9			Grid Array			.873 V				1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1
XC2S50E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384				23000	1.8			Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 50000	e0	357 MHz				23 mm
XC7A30T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	33600	Yes	1.05 V		CMOS		250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B484			23 mm	No			1098 MHz		250		23 mm
XC7K325T-2FFV900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XCV100E-8FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8		1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	416 MHz	30 s	176	260 °C (500 °F)	17 mm
XC7V285T-1FFG1157C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes										Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ7VX690T-1RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	693120	Yes	1.03 V	54150	HKMG		350		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XCVU095-3FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	768			832		1			Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XA3S400A-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS			400000	1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XCE7VX330T-2FFV1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		700		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1761		3.77 mm	42.5 mm						700		42.5 mm
XC4VFX40-11FFG672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS		352				1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1181 MHz	30 s	352	250 °C (482 °F)
XC4VSX25-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS		320		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XC6SLX45-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		358		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	358	225 °C (437 °F)	27 mm
XCV150-6BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		180	164674	2.5		1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	864 CLBS, 164674 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	333 MHz	30 s	180	225 °C (437 °F)	27 mm
XC2V80-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	120	225 °C (437 °F)	17 mm
XC7K160T-2LFFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9			Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC3SD1800A-4CS484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No		e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC6SLX150T-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		396				1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	396	250 °C (482 °F)	27 mm
XQ6VSX475T-L1RF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	476000	Yes			CMOS		600		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1098 MHz		600
XC6VLX365T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7VX485T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm			e1		30 s	700	245 °C (473 °F)	42.5 mm
XC3S200-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0					27 mm
XC4013XL-09CBGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3			Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	217 MHz				27 mm
XCV200E-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8		1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	357 MHz	30 s	284	250 °C (482 °F)	23 mm
XC3S700AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1500-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XC2VP20-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		564		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2VP7-6FG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes			CMOS		396				1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B672				No					396
XC2V250-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V2000-5BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS			2000000	1.5			Grid Array			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	750 MHz	30 s		245 °C (473 °F)	40 mm
XCV1600E-7FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		700	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	700	225 °C (437 °F)	31 mm
XC2V4000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		824	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.