BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VCX195T-2FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC4VFX12-11FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XC6VSX475T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.67 ns	37200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC2S600E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS		514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	514	225 °C (437 °F)	27 mm
XC4VLX160-11FF1513IS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	152064	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1513	4			No		e0	1205 MHz	30 s	960	225 °C (437 °F)
XQ5VFX100T-1EF1738M	Xilinx	FPGA	Military	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8960	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.9 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1098 MHz		680		42.5 mm
XCKU035-1FBVA900E	Xilinx	FPGA	Commercial Extended	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XQVU095-1RFC1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes		67200			520		.95		Grid Array					100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XC7K480T-1FF1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC7K410T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775					.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC4036XLA-07BG352I	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	1296	Yes			CMOS		288		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B352	3			No		e0	294 MHz	30 s	288	225 °C (437 °F)
XC4VFX40-12FFG672CS1	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		352		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.15 ns	4656 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VLX100-12FF1148CS2	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V		CMOS		768		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC7K480T-2FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS		380		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	380	245 °C (473 °F)	31 mm
XC4013XLA-09BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	576 CLBS, 10000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e1	227 MHz	30 s		250 °C (482 °F)	27 mm
XC5VSX50T-1FFG665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC6VLX550T-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2V40-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	650 MHz	30 s	88	260 °C (500 °F)	17 mm
XC6SLX150-3NFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XCVU125-L1FLVA2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200					.9		Grid Array			.873 V				1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1
XC2VP40-7FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1350 MHz	30 s	804	225 °C (437 °F)	35 mm
XCKU060-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			624		35 mm
XCKU115-2FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC3S500E-4FG320IS1	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC6SLX100T-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS		376			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0		30 s	376	225 °C (437 °F)	27 mm
XC4VLX100-12FFG1148CS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4			No		e1	1205 MHz	30 s	768	245 °C (473 °F)
XC7VX485T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760			42.5 mm	No		e0	1818 MHz		700		42.5 mm
XC3S2000-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	725 MHz	30 s	333	225 °C (437 °F)	23 mm
XC2S100E-6FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		202	37000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	600 CLBS, 37000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 100000	e1	357 MHz	30 s	202	260 °C (500 °F)	17 mm
XC5VFX70T-1FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	5600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC4VSX35-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS		448			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No		e0	1028 MHz	30 s	448	225 °C (437 °F)
XC2S150E-6FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS		265	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	265	260 °C (500 °F)	17 mm
XCVU080-H1FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714			832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XC6VLX75T-1LFF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	.93 V								Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		3 mm	23 mm	No		e0					23 mm
XQ6VSX315T-L1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	315000	Yes			CMOS		600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4			No		e1	1098 MHz	30 s	600	245 °C (473 °F)
XC4085XL-09BG560I	Xilinx	FPGA		Ball	560	BGA	Square	Plastic/Epoxy	3136	Yes			CMOS		448		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3			No		e0	217 MHz	30 s	448	225 °C (437 °F)
XC7K480T-2FFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA901,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1					31 mm
XQKU5P-1FFRB676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	125 °C (257 °F)		27120 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.67 mm	27 mm			e0		20 s	304	225 °C (437 °F)	27 mm
XC3S50AN-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XCV600-6FG600C	Xilinx	FPGA		Ball	600	BGA		Plastic/Epoxy	15552	Yes			CMOS		404			1.2/3.6,2.5 V	Grid Array	BGA600(UNSPEC)	Field Programmable Gate Arrays								Bottom					No					404
XC7A75T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			300		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC5VFX100T-1FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8000 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	680	225 °C (437 °F)	42.5 mm
XC4VLX60-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XCE7VX485T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		350		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s	350	245 °C (473 °F)	35 mm
XC6VLX550T-2FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		840		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XCV150-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	294 MHz				17 mm
XC2V80-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	820 MHz	30 s	120	225 °C (437 °F)	17 mm
XCKU075-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	756000	Yes	.979 V	2592			520		.95		Grid Array			.922 V	1 mm	85 °C (185 °F)		2592 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			520		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.