BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4028XL-09BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes			CMOS		256		3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No		e0	217 MHz	30 s	256	225 °C (437 °F)
XC4VLX40-11FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e1	1205 MHz	30 s	640	245 °C (473 °F)	35 mm
XC6SLX100T-3NFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC4020XLA-08BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	784 CLBS, 13000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e0	263 MHz	30 s	224	225 °C (437 °F)	27 mm
XC3S50AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC2VPX70-5FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		992		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin Lead	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	992	225 °C (437 °F)	42.5 mm
XC5VLX30-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XQZU11EG-1FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XCKU11P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XC5VLX330-2FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	1200	245 °C (473 °F)	42.5 mm
XC4013E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC6VLX760-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS		1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XA6SLX45T-3FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XC7K480T-3FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325					1		Grid Array			.97 V	1 mm		0.58 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XA6SLX9-3FTG256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	9152	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC7V2000T-2LFHG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700			850		1		Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm			e1			850		45 mm
XQ5VSX240T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.5 mm	42.5 mm	No		e0	1098 MHz		960		42.5 mm
XC2V6000-5FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	1104	225 °C (437 °F)	40 mm
XC7K160T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675					1		Grid Array			.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC2VP20-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC6VLX365T-1LFF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.97 V								Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0		30 s		225 °C (437 °F)	42.5 mm
XCV200-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		284	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	333 MHz	30 s	284	225 °C (437 °F)	23 mm
XC5VLX330-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VSX240T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	18720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm
XC4VLX200-11FFG1513CS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1513	4			No		e1	1205 MHz	30 s	960	245 °C (473 °F)
XC4VFX20-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XCKU115-1FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XC4VLX60-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS				1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0					27 mm
XCKU100-2FLVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200			524		.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	524	245 °C (473 °F)	40 mm
XC5VSX35T-3FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2720 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC4VLX40-11FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC6VCX130T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XCV200E-8FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	1176 CLBS, 63504 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	416 MHz	30 s	284	250 °C (482 °F)	23 mm
XC6SLX75-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		408		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	408	250 °C (482 °F)	27 mm
XCS40XL-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e1	250 MHz	30 s	205	250 °C (482 °F)	27 mm
XQ6SLX75T-3FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No		e1	862 MHz	30 s	348	250 °C (482 °F)
XC5VSX35T-2FF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0		30 s	360	225 °C (437 °F)	27 mm
XC5VLX50-2FFV1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			560		1		Grid Array	BGA1153,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm			e1		30 s	560	245 °C (473 °F)	35 mm
XC3S1000-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes			CMOS		333			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B456	3			No		e0		30 s	333	225 °C (437 °F)
XC6VLX130T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7VX690T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC3S200AN-4FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	448 CLBS, 200000 Gates		Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz				23 mm
XC7K160T-1FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC5VLX30-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC7V855T-1FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4028XLA-09BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	27 mm
XC2VP30-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XA6SLX100-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911			326		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			326		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.