BGA Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV1600E-6FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		512	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1	357 MHz	30 s	512	260 °C (500 °F)	40 mm
XCE7VX330T-1FFG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		700		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm			e1		30 s	700	245 °C (473 °F)	42.5 mm
XC5VFX30T-3FF665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0			360		27 mm
XC6SLX150-L1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		338		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	338	250 °C (482 °F)	23 mm
XA3S1500-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328		AEC-Q100	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		3328 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	125 MHz	30 s	487	260 °C (500 °F)	27 mm
XC4VLX80-12FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy		Yes	1.26 V	8960	CMOS				1.2		Grid Array			1.14 V	1 mm			8960 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0		30 s		225 °C (437 °F)	35 mm
XCV300-5FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e0					40 mm
XCS40XL-4BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	784 CLBS, 13000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e1	217 MHz	30 s	205	250 °C (482 °F)	27 mm
XC6VCX240T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC2VP4-7FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	752 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1350 MHz	30 s	140	260 °C (500 °F)	17 mm
XCE7VX330T-1FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC4VFX100-11XFF1152C	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS		576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1205 MHz	30 s	576	225 °C (437 °F)
XC4VFX20-11FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	320	250 °C (482 °F)	27 mm
XC7VH580T-G2FLG1155E	Xilinx	FPGA		Ball	1155	BGA	Square	Plastic/Epoxy		Yes	1.03 V	45350					1		Grid Array			.97 V			0.61 ns	45350 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1155						e1
5962-9957401QXX	Xilinx	FPGA	Military	Ball	560	BGA	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V		CMOS			1124022	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-B560		5.35 mm	42.5 mm	No							42.5 mm
XCE7K420T-3FFV1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XC2V1500-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No		e1	650 MHz		392		31 mm
XC7K325T-L2FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCV1600E-6FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XC5VLX50-1FFV1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			560		1		Grid Array	BGA1153,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm			e1		30 s	560	245 °C (473 °F)	35 mm
XC4VLX200-10FFG1513CS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1513	4			No		e1	1028 MHz	30 s	960	245 °C (473 °F)
XCV300-4FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e0					40 mm
XQ6VLX550T-L1RF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic	550000	Yes			CMOS		840		.9	0.9 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1759	4			No		e0	1098 MHz		840
XC5VLX50-3FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC4VLX40-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC6SLX100T-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XCV600-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		444	661111	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	333 MHz	30 s	444	225 °C (437 °F)	27 mm
XCVU11P-3FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000			624		0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm						624		47.5 mm
XC2V1500-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		528	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	750 MHz	30 s	528	225 °C (437 °F)	31 mm
XC7V285T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XCE7K480T-1FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG		380		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37325 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC4013XLA-07BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e0	294 MHz	30 s	192	225 °C (437 °F)	27 mm
XC7V1500T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XQ5VFX70T-1EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
XC6VHX565T-2FFG1923E	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes			CMOS		720			1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1923	4			No		e1	1286 MHz	30 s	720	245 °C (473 °F)
XC2S50E-6FTG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 50000	e1	357 MHz	30 s	182	260 °C (500 °F)	17 mm
XC7K480T-L2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1286 MHz		400
XCV1600E-7FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XC4VLX60-10FF668CS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No		e0	1028 MHz	30 s	448	225 °C (437 °F)
XC2VP4-7FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		348		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0	1350 MHz	30 s	348	220 °C (428 °F)	27 mm
XCV200E-8FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	416 MHz	30 s	284	225 °C (437 °F)	23 mm
XCVU11P-2FLGF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	37320			624		.85		Grid Array	BGA1924,44X44,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm						624		45 mm
XC6VHX380T-2FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1286 MHz		320		35 mm
XC3S4000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s		225 °C (437 °F)	19 mm
DY6035BG432EI	Xilinx	FPGA		Ball	432	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	256	225 °C (437 °F)
XC7VX485T-L2FF1930E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		700
XC4VLX100-11FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS		768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			12288 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC2V6000-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	1104	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.