BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VFX100-12FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.26 V	10544	CMOS				1.2		Grid Array			1.14 V	1 mm			10544 CLBS		Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XQ7VX330T-L2RF1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm		e0			600		35 mm
XQ6SLX150-L1FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		498			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No	e0	500 MHz	30 s	498	225 °C (437 °F)
XA3S250E-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS			250000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XC3S4000-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0					23 mm
XQ6SLX75-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e1		30 s	280	250 °C (482 °F)	23 mm
XC6VLX760-L1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V		CMOS		1200		.9	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XC4VLX100-11FF1513CS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1513	4			No	e0	1205 MHz	30 s	960	225 °C (437 °F)
XC7V285T-1FFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XCS300E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS		329		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns		0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No	e0	357 MHz		329		17 mm
XC2V1500-6FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	820 MHz	30 s	392	250 °C (482 °F)	27 mm
XC7K325T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm		e1		30 s		250 °C (482 °F)	27 mm
XQ6VLX240T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes		18840	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XCV50-4BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		180	57906	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	e0	250 MHz	30 s	180	225 °C (437 °F)	27 mm
XC4036XL-09BG352I	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	1296	Yes			CMOS		288		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3			No	e0	217 MHz	30 s	288	225 °C (437 °F)
XC7V285T-3FFG784I	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No	e1		30 s		245 °C (473 °F)
XC2V3000-6BG728I	Xilinx	FPGA		Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No	e0	820 MHz		516		35 mm
XCV100-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XC6VCX195T-2FFG784I	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XQ6SLX150-L1FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		338			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No	e0	500 MHz	30 s	338	225 °C (437 °F)
XC5VLX330T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm				30 s	960	245 °C (473 °F)	42.5 mm
XC4VFX60-11FF1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS		576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No	e0	1181 MHz	30 s	576	225 °C (437 °F)
XC6SLX100T-3NFGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	806 MHz				31 mm
XC7V855T-3FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XC7K420T-2LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575			400		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	250 °C (482 °F)	35 mm
XC6VCX130T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC7V1500T-1FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array							229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No	e1		30 s		250 °C (482 °F)
XC3S4000-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS		712	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XQ5VSX50T-2EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No	e0	1265 MHz		360		27 mm
XC7A50T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XCV200-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm		0.7 ns	1176 CLBS, 236666 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	294 MHz	30 s		250 °C (482 °F)	23 mm
XC5VSX240T-2FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	18720 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No	e0		30 s	960	225 °C (437 °F)	42.5 mm
XC2VP125-5FFG1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS				1.5		Grid Array			1.425 V	1 mm		0.36 ns	13904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s		245 °C (473 °F)	42.5 mm
XC6VLX240T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes			CMOS		600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No	e1	1286 MHz	30 s	600	245 °C (473 °F)
XC7VX690T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		720		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XQKU15P-1FFRE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm		e0		20 s	564	225 °C (437 °F)	40 mm
XC7A30T-L2FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	33600	Yes	1.05 V		CMOS		250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B484			23 mm	No		1286 MHz		250		23 mm
XCE7VX690T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7VX485T-2FF1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No	e0	1818 MHz		700
XC7A200T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825			500		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XCKU035-2FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95	0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No	e1			520		27 mm
XCE7VX980T-2FFG1928C	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG		480		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1928		3.65 mm	45 mm					480		45 mm
XC5VLX155T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No	e0		30 s	640	225 °C (437 °F)	35 mm
XC4VFX60-12FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No	e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC7VX415T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		350		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCV1000E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	357 MHz		660		35 mm
XC7K410T-2LFFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1					31 mm
XC7K160T-L2FF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No	e0	1286 MHz		400

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.