Xilinx - XQ7K325T-L2RF900E

XQ7K325T-L2RF900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7K325T-L2RF900E
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Technology Used: HKMG;
Datasheet XQ7K325T-L2RF900E Datasheet
In Stock95
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 25475 CLBS
Maximum Combinatorial Delay of a CLB: 0.91 ns
Maximum Seated Height: 3.44 mm
No. of Inputs: 500
Surface Mount: Yes
No. of Outputs: 500
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 31 mm
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): .9
Technology Used: HKMG
No. of Logic Cells: 326080
No. of CLBs: 25475
Minimum Operating Temperature: 0 °C (32 °F)
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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