Xilinx - XQ7K325T-1RF676M

XQ7K325T-1RF676M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7K325T-1RF676M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ7K325T-1RF676M Datasheet
In Stock308
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 25475 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.74 ns
Maximum Seated Height: 3.37 mm
No. of Inputs: 400
Surface Mount: Yes
No. of Outputs: 400
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 326080
No. of CLBs: 25475
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Plant 5!
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Pricing (USD)

Qty. Unit Price Ext. Price
308 $266.000 $81,928.000

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