Xilinx - XC2S200-5FGG456Q

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XC2S200-5FGG456Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S200-5FGG456Q
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2S200-5FGG456Q Datasheet
In Stock96
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 864 CLBS, 200000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 200000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Automotive
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
No. of CLBs: 864
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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